| Patent | Date |
|---|
Semiconductor device package and apparatus comprising the same
Grant 11,244,936 - Im , et al. February 8, 2 | 2022-02-08 |
Semiconductor Package
App 20210217735 - SEO; Sun-kyoung ; et al. | 2021-07-15 |
Image Sensor Package
App 20210202563 - KIM; Ji-hwang ; et al. | 2021-07-01 |
Interposer, semiconductor package, and method of fabricating interposer
Grant 11,018,026 - Kang , et al. May 25, 2 | 2021-05-25 |
Semiconductor package
Grant 10,991,677 - Seo , et al. April 27, 2 | 2021-04-27 |
Image sensor package
Grant 10,971,535 - Kim , et al. April 6, 2 | 2021-04-06 |
Semiconductor package
Grant 10,867,970 - Seo , et al. December 15, 2 | 2020-12-15 |
Semiconductor Package
App 20200286862 - SEO; Sun-kyoung ; et al. | 2020-09-10 |
Substrate structures for image sensor modules and image sensor modules including the same
Grant 10,750,112 - Kim , et al. A | 2020-08-18 |
Semiconductor Package
App 20200243488 - SEO; Sun-kyoung ; et al. | 2020-07-30 |
Semiconductor package and image sensor
Grant 10,680,025 - Shim , et al. | 2020-06-09 |
Semiconductor package
Grant 10,658,341 - Seo , et al. | 2020-05-19 |
Interposer, Semiconductor Package, And Method Of Fabricating Interposer
App 20200144076 - KANG; UN-BYOUNG ; et al. | 2020-05-07 |
Method of fabricating an interposer
Grant 10,535,534 - Kang , et al. Ja | 2020-01-14 |
Apparatus for stacking semiconductor chips in a semiconductor package
Grant 10,483,150 - Lee , et al. Nov | 2019-11-19 |
Semiconductor Package
App 20190312013 - SEO; Sun-kyoung ; et al. | 2019-10-10 |
Semiconductor Device Package And Apparatus Comprising The Same
App 20190295998 - IM; Yun Hyeok ; et al. | 2019-09-26 |
Semiconductor package
Grant 10,373,935 - Seo , et al. | 2019-08-06 |
Substrate Structures For Image Sensor Modules And Image Sensor Modules Including The Same
App 20190174087 - KIM; Ji-Hwang ; et al. | 2019-06-06 |
Semiconductor Package and Image Sensor
App 20190103432 - Shim; Jong Bo ; et al. | 2019-04-04 |
Semiconductor package including a rewiring layer with an embedded chip
Grant 10,224,272 - Kim , et al. | 2019-03-05 |
Semiconductor Package
App 20180374825 - SEO; Sun-kyoung ; et al. | 2018-12-27 |
Methods of manufacturing semiconductor packages
Grant 10,141,286 - Lee , et al. Nov | 2018-11-27 |
Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip
Grant 10,134,702 - Seo , et al. November 20, 2 | 2018-11-20 |
Semiconductor Device Package And Method For Fabricating The Same
App 20180315740 - IM; Yun Hyeok ; et al. | 2018-11-01 |
Semiconductor Package Including A Rewiring Layer With An Embedded Chip
App 20180294216 - KIM; JI-HWANG ; et al. | 2018-10-11 |
Semiconductor package
Grant 10,083,939 - Seo , et al. September 25, 2 | 2018-09-25 |
Semiconductor package and method of manufacturing the same
Grant 10,026,724 - Kim , et al. July 17, 2 | 2018-07-17 |
Semiconductor package including a rewiring layer with an embedded chip
Grant 9,997,446 - Kim , et al. June 12, 2 | 2018-06-12 |
Image Sensor Package
App 20180145104 - KIM; Ji-hwang ; et al. | 2018-05-24 |
Methods Of Manufacturing Semiconductor Packages
App 20180061812 - LEE; WON-IL ; et al. | 2018-03-01 |
Semiconductor Package Including A Rewiring Layer With An Embedded Chip
App 20180040548 - KIM; JI-HWANG ; et al. | 2018-02-08 |
Semiconductor Package And Method Of Manufacturing The Same
App 20180006006 - Kim; Ji-hwang ; et al. | 2018-01-04 |
Semiconductor Package
App 20170338206 - SEO; Sun-kyoung ; et al. | 2017-11-23 |
Interposer, Semiconductor Package, And Method Of Fabricating Interposer
App 20170330767 - Kang; Un-Byoung ; et al. | 2017-11-16 |
Apparatus For Stacking Semiconductor Chips In A Semiconductor Package
App 20170236798 - LEE; GUN-AH ; et al. | 2017-08-17 |
Semiconductor Chip, Semiconductor Package Including The Same, And Method Of Manufacturing Semiconductor Chip
App 20170229412 - SEO; Sun-kyoung ; et al. | 2017-08-10 |
Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate
Grant 9,728,424 - Kim , et al. August 8, 2 | 2017-08-08 |
Semiconductor Chip, Semiconductor Package Including The Same, And Method Of Manufacturing Semiconductor Chip
App 20170170136 - SEO; Sun-kyoung ; et al. | 2017-06-15 |
Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip
Grant 9,666,551 - Seo , et al. May 30, 2 | 2017-05-30 |
Photonic integrated circuit
Grant 9,618,716 - Park , et al. April 11, 2 | 2017-04-11 |
Semiconductor package having stacked semiconductor chips
Grant 9,589,945 - Jo , et al. March 7, 2 | 2017-03-07 |
Semiconductor Package And Method Of Manufacturing The Same
App 20170047310 - SHIM; Jong-Bo ; et al. | 2017-02-16 |
Stacked semiconductor package
Grant 9,543,231 - Choi , et al. January 10, 2 | 2017-01-10 |
Photonic Integrated Circuit
App 20160266341 - PARK; Sang-Cheon ; et al. | 2016-09-15 |
Semiconductor Package
App 20160225721 - CHOI; EUN-KYOUNG ; et al. | 2016-08-04 |
Semiconductor Package Having Stacked Semiconductor Chips
App 20160093598 - JO; Cha-jea ; et al. | 2016-03-31 |
Semiconductor Package And Method Of Manufacturing The Same
App 20160013091 - Kim; Ji-hwang ; et al. | 2016-01-14 |
Semiconductor package and method of manufacturing the semiconductor package
Grant 9,159,659 - Kim , et al. October 13, 2 | 2015-10-13 |
Stacked Semiconductor Package
App 20150200154 - CHOI; Yun-seok ; et al. | 2015-07-16 |
Semiconductor Package And Method Of Manufacturing The Same
App 20150162265 - JO; Cha-Jea ; et al. | 2015-06-11 |
Method of fabricating semiconductor multi-chip stack packages
Grant 8,980,689 - Kwak , et al. March 17, 2 | 2015-03-17 |
Method of fabricating semiconductor device including a substrate attached to a carrier
Grant 8,912,048 - Kim , et al. December 16, 2 | 2014-12-16 |
Method Of Fabricating Semiconductor Multi-chip Stack Packages
App 20140273350 - KWAK; BYOUNG-SOO ; et al. | 2014-09-18 |
Semiconductor Package And Method Of Fabricating The Same
App 20140252605 - MA; Keum-Hee ; et al. | 2014-09-11 |
Semiconductor Device And Method For Fabricating The Same
App 20140239478 - HONG; Ji-Seok ; et al. | 2014-08-28 |
Method Of Fabricating Semiconductor Device
App 20140213017 - KIM; Jong-Youn ; et al. | 2014-07-31 |
Flip chip package
Grant 8,723,315 - Lee , et al. May 13, 2 | 2014-05-13 |
Semiconductor Package And Method Of Manufacturing The Semiconductor Package
App 20130299969 - KIM; Sang-Won ; et al. | 2013-11-14 |
Flip Chip Package
App 20120223427 - LEE; Jong-Joo ; et al. | 2012-09-06 |
Flip chip package
Grant 8,178,969 - Lee , et al. May 15, 2 | 2012-05-15 |
Method of manufacturing a chip stack package
Grant 8,088,648 - Jo , et al. January 3, 2 | 2012-01-03 |
Chip Stack Package And Method Of Manufacturing The Chip Stack Package
App 20100285635 - Jo; Cha-Jea ; et al. | 2010-11-11 |
Stacked chip package and method for forming the same
Grant 7,638,365 - Jeong , et al. December 29, 2 | 2009-12-29 |
Stack-type semiconductor device having cooling path on its bottom surface
Grant 7,626,260 - Chung , et al. December 1, 2 | 2009-12-01 |
Probe Card Having Redistributed Wiring Probe Needle Structure And Probe Card Module Using The Same
App 20090278561 - Jo; Cha-jea ; et al. | 2009-11-12 |
Flip Chip Package
App 20090230549 - Lee; Jong-Joo ; et al. | 2009-09-17 |
Chip Stack Package And Method Of Manufacturing The Chip Stack Package
App 20080230923 - JO; Cha-Jea ; et al. | 2008-09-25 |
Semiconductor devices and methods of forming the same
App 20080157287 - Choi; Ju-Il ; et al. | 2008-07-03 |
Stacked semiconductor packages and methods of manufacturing stacked semiconductor packages
App 20080157332 - Jo; Cha-Jea ; et al. | 2008-07-03 |
Semiconductor plating system for plating semiconductor object
App 20080141933 - Jo; Cha-jea ; et al. | 2008-06-19 |
Stacked Chip Package And Method For Forming The Same
App 20080096315 - JEONG; Se-Young ; et al. | 2008-04-24 |
Stack-type Semiconductor Device Having Cooling Path On Its Bottom Surface
App 20070267738 - CHUNG; Hyun-Soo ; et al. | 2007-11-22 |
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