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name:-0.012615919113159
name:-0.0084340572357178
name:-0.0040099620819092
Jiu; Jinting Patent Filings

Jiu; Jinting

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jiu; Jinting.The latest application filed is for "electrically conductive paste, laminated body, and method for bonding cu substrate or cu electrode to electrical conductor".

Company Profile
3.7.11
  • Jiu; Jinting - Tokyo JP
  • Jiu; Jinting - Suita JP
  • JIU; Jinting - Suita-shi JP
  • Jiu; Jinting - Kyoto JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electrically conductive paste, laminated body, and method for bonding Cu substrate or Cu electrode to electrical conductor
Grant 11,278,955 - Jiu , et al. March 22, 2
2022-03-22
ELECTRICALLY CONDUCTIVE PASTE, LAMINATED BODY, AND METHOD FOR BONDING Cu SUBSTRATE OR Cu ELECTRODE TO ELECTRICAL CONDUCTOR
App 20220040758 - JIU; Jinting ;   et al.
2022-02-10
Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part
Grant 11,217,359 - Jiu , et al. January 4, 2
2022-01-04
Method For Synthesizing Copper-silver Alloy, Method For Forming Conduction Part, Copper-silver Alloy, And Conduction Part
App 20210366627 - JIU; Jinting ;   et al.
2021-11-25
Electrically Conductive Paste And Sintered Body
App 20210245242 - JIU; Jinting ;   et al.
2021-08-12
Silver particle producing method, silver particles, and silver paste
Grant 10,875,097 - Suganuma , et al. December 29, 2
2020-12-29
Method For Synthesizing Copper-silver Alloy, Method For Forming Conduction Part, Copper-silver Alloy, And Conduction Part
App 20200381136 - JIU; Jinting ;   et al.
2020-12-03
Conductive paste having dilatancy, electrode connection structure including the paste, and method for producing the structure
Grant 10,651,143 - Satoh , et al.
2020-05-12
Method for producing copper particles, copper particles, and copper paste
Grant 10,625,344 - Suganuma , et al.
2020-04-21
Silver Particle Producing Method, Silver Particles, And Silver Paste
App 20200086391 - SUGANUMA; Katsuaki ;   et al.
2020-03-19
Conductive Paste, Electrode Connection Structure, And Electrode Connection Structure Production Method
App 20190157229 - SATOH; Tomotoshi ;   et al.
2019-05-23
Silver particle synthesizing method, silver particles, conductive paste producing method, and conductive paste
Grant 10,201,852 - Suganuma , et al. Feb
2019-02-12
Method for producing metal nanowires and silver nanowires
Grant 10,099,291 - Suganuma , et al. October 16, 2
2018-10-16
Method For Producing Copper Particles, Copper Particles, And Copper Paste
App 20180104747 - SUGANUMA; Katsuaki ;   et al.
2018-04-19
Silver Particle Synthesizing Method, Silver Particles, Conductive Paste Producing Method, And Conductive Paste
App 20170144220 - SUGANUMA; Katsuaki ;   et al.
2017-05-25
Method For Producing Metal Nanowires, Metal Nanowires, Method For Producing Silver Nanowires, And Silver Nanowires
App 20160121403 - SUGANUMA; Katsuaki ;   et al.
2016-05-05
Method For Manufacturing Transparent Conductive Pattern
App 20150030783 - Suganuma; Katsuaki ;   et al.
2015-01-29
Titania Crystal, Process for Producing the Same, Layered Titania Substrate, and Dye-sensitized Solar Cell
App 20120067405 - Jiu; Jinting ;   et al.
2012-03-22

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