loadpatents
name:-0.0077090263366699
name:-0.0070381164550781
name:-0.0025770664215088
Jirage; Kshama Patent Filings

Jirage; Kshama

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jirage; Kshama.The latest application filed is for "multiplexed analysis of nucleic acid hybridization thermodynamics using integrated arrays".

Company Profile
2.7.5
  • Jirage; Kshama - Palo Alto CA
  • Jirage; Kshama - Branford CT US
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multiplexed analysis of nucleic acid hybridization thermodynamics using integrated arrays
Grant 10,501,778 - Hassibi , et al. Dec
2019-12-10
Methods and systems for multiplex quantitative nucleic acid amplification
Grant 10,174,367 - Hassibi , et al. J
2019-01-08
Multiplexed Analysis Of Nucleic Acid Hybridization Thermodynamics Using Integrated Arrays
App 20180023129 - HASSIBI; Arjang ;   et al.
2018-01-25
Multiplexed analysis of nucleic acid hybridization thermodynamics using integrated arrays
Grant 9,708,647 - Hassibi , et al. July 18, 2
2017-07-18
Methods And Systems For Multiplex Quantitative Nucleic Acid Amplification
App 20170101666 - HASSIBI; Arjang ;   et al.
2017-04-13
Methods and systems for multiplex quantitative nucleic acid amplification
Grant 9,499,861 - Hassibi , et al. November 22, 2
2016-11-22
Multiplexed Analysis Of Nucleic Acid Hybridization Thermodynamics Using Integrated Arrays
App 20160281149 - Hassibi; Arjang ;   et al.
2016-09-29
Defect reduction in electrodeposited copper for semiconductor applications
Grant 9,222,188 - Commander , et al. December 29, 2
2015-12-29
Defect Reduction In Electrodeposited Copper For Semiconductor Applications
App 20080121527 - Commander; John ;   et al.
2008-05-29
Defect reduction in electrodeposited copper for semiconductor applications
Grant 7,316,772 - Commander , et al. January 8, 2
2008-01-08
Defect reduction in electrodeposited copper for semiconductor applications
App 20030168343 - Commander, John ;   et al.
2003-09-11

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