JING; Changyou

Patent Applications and Registrations

Patent applications and USPTO patent grants for JING; Changyou.The latest application filed is for "in situ real-time sensing and compensation of non-uniformities in substrate processing systems".

Company Profile

3.2.9

JING; Changyou - Livermore CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
In Situ Real-time Sensing And Compensation Of Non-uniformities In Substrate Processing Systems App 20220277928 - JING; Changyou ; et al.	2022-09-01
Power And Data Transmission To Substrate Support In Plasma Chambers Via Optical Fiber App 20220247492 - JING; Changyou ; et al.	2022-08-04
Rf Immune Sensor Probe For Monitoring A Temperature Of An Electrostatic Chuck Of A Substrate Processing System App 20220238360 - TIAN; Siyuan ; et al.	2022-07-28
Electrostatic Chuck Heater Resistance Measurement To Approximate Temperature App 20220172925 - Jing; Changyou ; et al.	2022-06-02
Pin-lifter Test Substrate App 20220013388 - Daugherty; John E. ; et al.	2022-01-13
Identification Of And Compensation For A Failure In A Heater Array App 20210384053 - Jing; Changyou	2021-12-09
Real-time Control Of Temperature In A Plasma Chamber App 20210358727 - Jing; Changyou	2021-11-18
Real-time control of temperature in a plasma chamber Grant 11,087,962 - Jing August 10, 2	2021-08-10
Real-time Control Of Temperature In A Plasma Chamber App 20200027706 - Jing; Changyou	2020-01-23
Substrate Processing System Printed-circuit Control Board Assembly With One Or More Heater Layers App 20190166700 - Pape; Eric ; et al.	2019-05-30
Substrate processing system printed-circuit control board assembly with one or more heater layers Grant 10,306,776 - Pape , et al.	2019-05-28

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