Jin; Yonggang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jin; Yonggang.The latest application filed is for "device and method for calculating a vehicle trailer pose using a camera".

Company Profile

7.52.62

Jin; Yonggang - Shanghai CN
Jin; Yonggang - Singapore SG
Jin; Yonggang - Beijing CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Device and method for calculating a vehicle trailer pose using a camera Grant 11,341,678 - Jin May 24, 2	2022-05-24
Compact microelectronic integrated gas sensor Grant 11,231,386 - Teysseyre , et al. January 25, 2	2022-01-25
Method, apparatus, and computer readable storage medium for updating electronic map Grant 11,105,638 - Jin , et al. August 31, 2	2021-08-31
Method, apparatus, and computer readable medium for adjusting color annotation of an image Grant 10,909,724 - Duan , et al. February 2, 2	2021-02-02
Method, apparatus, and device for determining lane line on road Grant 10,885,352 - Duan , et al. January 5, 2	2021-01-05
Method and apparatus for creating map and positioning moving entity Grant 10,878,621 - Zhou , et al. December 29, 2	2020-12-29
Device And Method For Calculating A Vehicle Trailer Pose Using A Camera App 20200402257 - Jin; Yonggang	2020-12-24
Method and apparatus for detecting lane line, and medium Grant 10,846,543 - Duan , et al. November 24, 2	2020-11-24
Method and apparatus for fusing point cloud data Grant 10,789,771 - Zhou , et al. September 29, 2	2020-09-29
Wafer level packaging, optical detection sensor and method of forming same Grant 10,381,504 - Jin , et al. A	2019-08-13
Method, Apparatus, And Computer Readable Medium For Processing Image App 20190206088 - DUAN; Xiong ; et al.	2019-07-04
Method And Apparatus For Detecting Lane Line, And Medium App 20190205664 - Duan; Xiong ; et al.	2019-07-04
Method, Apparatus, And Device For Determining Lane Line On Road App 20190205665 - Duan; Xiong ; et al.	2019-07-04
Method, Apparatus, And Computer Readable Storage Medium For Updating Electronic Map App 20190204094 - Jin; Yonggang ; et al.	2019-07-04
Method And Apparatus For Creating Map And Positioning Moving Entity App 20190206124 - ZHOU; Wang ; et al.	2019-07-04
Method And Apparatus For Fusing Point Cloud Data App 20190206123 - ZHOU; Wang ; et al.	2019-07-04
Semiconductor packages with pillar and bump structures Grant 10,128,207 - Liu , et al. November 13, 2	2018-11-13
Semiconductor optical package and method Grant 10,115,842 - Jin , et al. October 30, 2	2018-10-30
Wafer Level Packaging, Optical Detection Sensor And Method Of Forming Same App 20180248068 - Jin; Yonggang ; et al.	2018-08-30
Cored Solder Wire With Rosin Flux And Thermoset Material App 20180229334 - JIN; Yonggang ; et al.	2018-08-16
Wafer level packaging, optical detection sensor and method of forming same Grant 9,991,409 - Jin , et al. June 5, 2	2018-06-05
Compact Microelectronic Integrated Gas Sensor App 20180067074 - Teysseyre; Jerome ; et al.	2018-03-08
Semiconductor Optical Package And Method App 20180053861 - JIN; Yonggang ; et al.	2018-02-22
Compact microelectronic integrated gas sensor Grant 9,851,328 - Teysseyre , et al. December 26, 2	2017-12-26
Semiconductor optical package and method Grant 9,831,357 - Jin , et al. November 28, 2	2017-11-28
Method for making an optical proximity sensor by attaching an optical element to a package top plate and forming a package body to define an optical transmit cavity and an optical receive cavity Grant 9,780,080 - Jin October 3, 2	2017-10-03
Semiconductor Packages With Pillar And Bump Structures App 20160293559 - Liu; Yun ; et al.	2016-10-06
Integrated circuit package and method of forming the same Grant 9,455,241 - Jin , et al. September 27, 2	2016-09-27
Gas sensor device with frame passageways and related methods Grant 9,448,216 - Jin , et al. September 20, 2	2016-09-20
Cored Solder Wire With Rosin Flux And Thermoset Material App 20160184938 - JIN; Yonggang ; et al.	2016-06-30
Gas Sensor Device With Frame Passageways And Related Methods App 20160103109 - JIN; Yonggang ; et al.	2016-04-14
Method For Making An Optical Proximity Sensor App 20160104698 - Jin; Yonggang	2016-04-14
Wafer Level Packaging, Optical Detection Sensor And Method Of Forming Same App 20160099373 - Jin; Yonggang ; et al.	2016-04-07
Compact Microelectronic Integrated Gas Sensor App 20160047774 - Teysseyre; Jerome ; et al.	2016-02-18
System-in-packages And Methods For Forming Same App 20160035590 - Jin; Yonggang	2016-02-04
System-in-packages and methods for forming same Grant 9,252,030 - Jin February 2, 2	2016-02-02
Integrated Circuit Package And Method Of Forming The Same App 20150303168 - JIN; YONGGANG ; et al.	2015-10-22
Image sensor device with IR filter and related methods Grant 9,059,058 - Teysseyre , et al. June 16, 2	2015-06-16
Optoelectronics assembly and method of making optoelectronics assembly Grant 9,018,645 - Jin April 28, 2	2015-04-28
Reducing warpage for fan-out wafer level packaging Grant 9,012,269 - Jin , et al. April 21, 2	2015-04-21
Semiconductor package with improved pillar bump process and structure Grant 9,013,037 - Jin April 21, 2	2015-04-21
Method for making image sensors using wafer-level processing and associated devices Grant 9,013,017 - Jin , et al. April 21, 2	2015-04-21
Optoelectronics Assembly And Method Of Making Optoelectronics Assembly App 20150060891 - Jin; Yonggang	2015-03-05
Image Sensor Device With Infrared Filter Adhesively Secured To Image Sensor Integrated Circuit And Related Methods App 20150028187 - JIN; Yonggang ; et al.	2015-01-29
Apparatus and method for placing solder balls Grant 8,937,008 - Jin January 20, 2	2015-01-20
Embedded wafer level package for 3D and package-on-package applications, and method of manufacture Grant 8,916,481 - Gan , et al. December 23, 2	2014-12-23
Plasma treatment on semiconductor wafers Grant 8,912,653 - Gan , et al. December 16, 2	2014-12-16
Semiconductor Optical Package And Method App 20140353788 - Jin; Yonggang ; et al.	2014-12-04
Method of fabricating land grid array semiconductor package Grant 8,860,207 - Jin , et al. October 14, 2	2014-10-14
Electronic device including electrically conductive vias having different cross-sectional areas and related methods Grant 8,860,228 - Jin , et al. October 14, 2	2014-10-14
Electronic device having a contact recess and related methods Grant 8,836,117 - Jin , et al. September 16, 2	2014-09-16
Embedded wafer level ball grid array bar systems and methods Grant 8,796,139 - Ramasamy , et al. August 5, 2	2014-08-05
Embedded wafer level package for 3D and package-on-package applications, and method of manufacture Grant 8,779,601 - Gan , et al. July 15, 2	2014-07-15
Method Of Fabricating Land Grid Array Semiconductor Package App 20140191387 - JIN; Yonggang ; et al.	2014-07-10
Through hole via filling using electroless plating Grant 8,766,422 - Gan , et al. July 1, 2	2014-07-01
Electronic Device Including Electrically Conductive Vias Having Different Cross-sectional Areas And Related Methods App 20140175649 - Jin; Yonggang ; et al.	2014-06-26
Reconstituted wafer warpage adjustment Grant 8,728,831 - Gan , et al. May 20, 2	2014-05-20
Image Sensor Device With Ir Filter And Related Methods App 20140110565 - Teysseyre; Jerome ; et al.	2014-04-24
Method For Making Image Sensors Using Wafer-level Processing And Associated Devices App 20140103476 - JIN; Yonggang ; et al.	2014-04-17
Electronic Device Having A Contact Recess And Related Methods App 20140103521 - Jin; Yonggang ; et al.	2014-04-17
Method of fabricating land grid array semiconductor package Grant 8,664,044 - Jin , et al. March 4, 2	2014-03-04
Method For Making A Double-sided Fanout Semiconductor Package With Embedded Surface Mount Devices, And Product Made App 20140057394 - Ramasamy; Anandan ; et al.	2014-02-27
Through hole via filling using electroless plating Grant 8,617,987 - Gan , et al. December 31, 2	2013-12-31
Method for producing vias in fan-out wafers using dry film and conductive paste, and a corresponding semiconductor package Grant 8,535,980 - Chua , et al. September 17, 2	2013-09-17
Apparatus And Method For Placing Solder Balls App 20130171816 - Jin; Yonggang	2013-07-04
Embedded Wafer Level Ball Grid Array Bar Systems And Methods App 20130168858 - Ramasamy; Anandan ; et al.	2013-07-04
Wafer Level Packaging, Optical Detection Sensor And Method Of Forming Same App 20130119282 - Jin; Yonggang ; et al.	2013-05-16
Embedded Wafer Level Package For 3d And Package-on-package Applications, And Method Of Manufacture App 20130105991 - Gan; Kah Wee ; et al.	2013-05-02
Land Grid Array Semiconductor Package And Method Of Manufacture App 20130105982 - Jin; Yonggang ; et al.	2013-05-02
Embedded Wafer Level Package For 3d And Package-on-package Applications, And Method Of Manufacture App 20130105973 - Gan; Kah Wee ; et al.	2013-05-02
Semiconductor Package With Improved Pillar Bump Process And Structure App 20130062764 - Jin; Yonggang	2013-03-14
Shielding techniques for an integrated circuit Grant 8,349,710 - Jin January 8, 2	2013-01-08
Method For Producing A Two-sided Fan-out Wafer Level Package With Electrically Conductive Interconnects, And A Corresponding Semiconductor Package App 20120282767 - Jin; Yonggang ; et al.	2012-11-08
Reducing Warpage For Fan-out Wafer Level Packaging App 20120244664 - Jin; Yonggang ; et al.	2012-09-27
Plasma Treatment On Semiconductor Wafers App 20120168938 - Gan; Kah Wee ; et al.	2012-07-05
Plasma Treatment On Semiconductor Wafers App 20120168943 - Gan; Kah Wee ; et al.	2012-07-05
Reconstituted Wafer Warpage Adjustment App 20120171875 - Gan; Kah Wee ; et al.	2012-07-05
Through Hole Via Filling Using Electroless Plating App 20120168944 - Gan; Kah Wee ; et al.	2012-07-05
Through Hole Via Filling Using Electroless Plating App 20120168942 - Gan; Kah Wee ; et al.	2012-07-05
Ball Grid Array Method And Structure App 20120161319 - Huang; Yaohuang ; et al.	2012-06-28
Method For Producing Vias In Fan-out Wafers Using Dry Film And Conductive Paste, And A Corresponding Semiconductor Package App 20120161332 - Chua; Puay Gek ; et al.	2012-06-28
Shielding Techniques For An Integrated Circuit App 20120098104 - Jin; Yonggang	2012-04-26
Manufacturing fan-out wafer level packaging Grant 8,119,454 - Jin February 21, 2	2012-02-21
Manufacturing Fan-out Wafer Level Packaging App 20120038043 - Jin; Yonggang	2012-02-16
Method For Manufacturing A Fan-out Embedded Panel Level Package App 20110156239 - Jin; Yonggang	2011-06-30
Integrated Circuit Package And Method Of Forming The Same App 20100187651 - JIN; Yonggang ; et al.	2010-07-29
Reducing Warpage For Fan-out Wafer Level Packaging App 20100167471 - Jin; Yonggang ; et al.	2010-07-01
Manufacturing Fan-out Wafer Level Packaging App 20100140788 - Jin; Yonggang	2010-06-10
System for different bond pads in an integrated circuit package Grant 7,443,039 - Zhao , et al. October 28, 2	2008-10-28
System for fabricating an integrated circuit package on a printed circuit board Grant 7,306,133 - Jin , et al. December 11, 2	2007-12-11
System For Different Bond Pads In An Integrated Circuit Package App 20060197223 - Zhao; Lun ; et al.	2006-09-07
Under bump metallurgy in integrated circuits App 20060160267 - Hur; Hyeong Ryeol ; et al.	2006-07-20
Method of manufacturing different bond pads on the same substrate of an integrated circuit package Grant 7,005,370 - Zhao , et al. February 28, 2	2006-02-28
Method Of Manufacturing Different Bond Pads On The Same Substrate Of An Integrated Circuit Package App 20050253262 - Zhao, Lun ; et al.	2005-11-17
Integrated Circuit Package With Different Hardness Bump Pad And Bump And Manufacturing Method Therefor App 20050242446 - Jin, Yonggang	2005-11-03
Integrated Circuit Package With Flat Metal Bump And Manufacturing Method Therefor App 20040222520 - Jin, Yonggang	2004-11-11
System for fabricating an integrated circuit package on a printed circuit board App 20040211817 - Jin, Yonggang ; et al.	2004-10-28

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