JIN; Yinuo
Patent Applications and Registrations
Patent applications and USPTO patent grants for JIN; Yinuo.The latest application filed is for "methods and apparatus for cleaning semiconductor wafers".
- JIN; Yinuo - Shanghai CN
| Patent | Date |
|---|---|
| Methods And Apparatus For Cleaning Semiconductor Wafers App 20220139697 - WANG; Jun ; et al. | 2022-05-05 |
| Plating Apparatus And Plating Method App 20220081796 - Jin; Yinuo ; et al. | 2022-03-17 |
| Methods and apparatus for cleaning semiconductor wafers Grant 11,257,667 - Wang , et al. February 22, 2 | 2022-02-22 |
| Methods And Apparatus For Cleaning Substrates App 20220037172 - WANG; Hui ; et al. | 2022-02-03 |
| Methods And Apparatus For Cleaning Substrates App 20220032344 - WANG; Hui ; et al. | 2022-02-03 |
| System For Cleaning Semiconductor Wafers App 20210402444 - WANG; Hui ; et al. | 2021-12-30 |
| System for cleaning semiconductor wafers Grant 11,141,762 - Wang , et al. October 12, 2 | 2021-10-12 |
| Methods and apparatus for cleaning substrates Grant 11,103,898 - Wang , et al. August 31, 2 | 2021-08-31 |
| Methods and apparatus for cleaning substrates Grant 11,037,804 - Wang , et al. June 15, 2 | 2021-06-15 |
| Methods And System For Cleaning Semiconductor Wafers App 20210125848 - Wang; Hui ; et al. | 2021-04-29 |
| Methods and system for cleaning semiconductor wafers Grant 10,910,244 - Wang , et al. February 2, 2 | 2021-02-02 |
| Methods And Apparatus For Cleaning Semiconductor Wafers App 20200335325 - Wang; Jun ; et al. | 2020-10-22 |
| Methods And Apparatus For Cleaning Substrates App 20190283090 - Wang; Hui ; et al. | 2019-09-19 |
| Methods And Apparatus For Cleaning Substrates App 20190287824 - Wang; Hui ; et al. | 2019-09-19 |
| Apparatus and method for plating and/or polishing wafer Grant 10,227,705 - Wang , et al. | 2019-03-12 |
| Methods And Apparatus For Cleaning Semiconductor Wafers App 20180151398 - Wang; Hui ; et al. | 2018-05-31 |
| Method For Cleaning Semiconductor Wafers App 20180071795 - Wang; Hui ; et al. | 2018-03-15 |
| System For Cleaning Semiconductor Wafers App 20180071794 - Wang; Hui ; et al. | 2018-03-15 |
| Method and apparatus for pulse electrochemical polishing Grant 9,865,476 - Wang , et al. January 9, 2 | 2018-01-09 |
| Nozzle for stress-free polishing metal layers on semiconductor wafers Grant 9,724,803 - Wang , et al. August 8, 2 | 2017-08-08 |
| Vacuum chuck Grant 9,558,985 - Wang , et al. January 31, 2 | 2017-01-31 |
| Apparatus And Method For Plating And/or Polishing Wafer App 20160115613 - Wang; Jian ; et al. | 2016-04-28 |
| Method And Apparatus For Pulse Electrochemical Polishing App 20150155183 - Wang; Jian ; et al. | 2015-06-04 |
| Vacuum Chuck App 20150069723 - Wang; Jian ; et al. | 2015-03-12 |
| Nozzle For Stress-free Polishing Metal Layers On Semiconductor Wafers App 20150072599 - Wang; Jian ; et al. | 2015-03-12 |
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