Jin; Lan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jin; Lan.The latest application filed is for "semiconductor structure and fabrication method thereof".
- Jin; Lan - Shanghai CN
- Jin; Lan - Paju-si KR
- Jin; Lan - Rego Park NY
| Patent | Date |
|---|---|
| Semiconductor structure and fabrication method thereof Grant 10,446,666 - Jin Oc | 2019-10-15 |
| Method for forming semiconductor structure having stress layers Grant 10,090,156 - Jin October 2, 2 | 2018-10-02 |
| Semiconductor fabrication method including non-uniform cover layer Grant 10,090,170 - Jin October 2, 2 | 2018-10-02 |
| Semiconductor Structure And Fabrication Method Thereof App 20180261684 - JIN; Lan | 2018-09-13 |
| Semiconductor Structure And Fabrication Method Thereof App 20170330765 - JIN; Lan | 2017-11-16 |
| Semiconductor Structure And Fabrication Method Thereof App 20170330758 - JIN; Lan | 2017-11-16 |
| Light emitting diode module and back light assembly Grant 8,439,513 - Yoon , et al. May 14, 2 | 2013-05-14 |
| Light emitting diode module and back light assembly App 20100165601 - Yoon; Jisu ; et al. | 2010-07-01 |
| Vehicle protecting cover device Grant 7,464,982 - Lin , et al. December 16, 2 | 2008-12-16 |
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