JIN; Jeong-gi
Patent Applications and Registrations
Patent applications and USPTO patent grants for JIN; Jeong-gi.The latest application filed is for "semiconductor chip".
- JIN; Jeong-gi - Seoul KR
- Jin; Jeong-Gi - Osan-si KR
- Jin; Jeong-gi - Gyeonggi-do KR
- Jin; Jeong Gi - Jeju-do KR
| Patent | Date |
|---|---|
| Semiconductor Chip App 20220108962 - JIN; Jeong-gi ; et al. | 2022-04-07 |
| Semiconductor chip Grant 11,251,144 - Jin , et al. February 15, 2 | 2022-02-15 |
| Semiconductor Device App 20210005565 - SON; Seong-Min ; et al. | 2021-01-07 |
| Semiconductor device Grant 10,833,032 - Son , et al. November 10, 2 | 2020-11-10 |
| Semiconductor Chip App 20200066666 - Jin; Jeong-gi ; et al. | 2020-02-27 |
| Semiconductor chip Grant 10,483,224 - Jin , et al. Nov | 2019-11-19 |
| Semiconductor Device App 20190067228 - SON; Seong-Min ; et al. | 2019-02-28 |
| Semiconductor Chip App 20180138137 - JIN; Jeong-gi ; et al. | 2018-05-17 |
| Integrated circuit devices having through-silicon vias and methods of manufacturing such devices Grant 9,735,090 - Choi , et al. August 15, 2 | 2017-08-15 |
| Integrated Circuit Devices Having Through-silicon Vias And Methods Of Manufacturing Such Devices App 20160099201 - Choi; Ju-il ; et al. | 2016-04-07 |
| Semiconductor device, semiconductor package, and electronic system Grant 9,240,366 - Jin , et al. January 19, 2 | 2016-01-19 |
| Integrated circuit devices including a through-silicon via structure and methods of fabricating the same Grant 9,214,411 - Park , et al. December 15, 2 | 2015-12-15 |
| Joint structures having organic preservative films Grant 9,082,680 - Choi , et al. July 14, 2 | 2015-07-14 |
| Integrated Circuit Devices Including a Through-Silicon Via Structure and Methods of Fabricating the Same App 20150102497 - Park; Jae-Hwa ; et al. | 2015-04-16 |
| Integrated circuit devices including through-silicon-vias having integral contact pads Grant 8,987,869 - Jin , et al. March 24, 2 | 2015-03-24 |
| Method Of Fabricating Semiconductor Device Having Bump App 20140329382 - HWANG; SON-KWAN ; et al. | 2014-11-06 |
| Semiconductor Device, Semiconductor Package, And Electronic System App 20140312491 - JIN; JEONG-GI ; et al. | 2014-10-23 |
| Semiconductor Device And Method For Fabricating The Same App 20140145327 - JEON; Hyung-Jun ; et al. | 2014-05-29 |
| Integrated Circuit Devices Including Through-silicon-vias Having Integral Contact Pads App 20130175673 - Jin; Jeong-gi ; et al. | 2013-07-11 |
| Joint Structures Having Organic Preservative Films App 20130000978 - Choi; Ju-Il ; et al. | 2013-01-03 |
| Semiconductor package having through holes Grant 7,843,072 - Park , et al. November 30, 2 | 2010-11-30 |
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