Jin; Ho-Tae

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jin; Ho-Tae.The latest application filed is for "multi-chip package and method of manufacturing the same".

Company Profile

0.12.14

Jin; Ho-Tae - Cheonan-si KR
JIN; Ho-Tae - Chungcheongnam-do KR
Jin, Ho-tae - Cheonan-city KR
Jin; Ho-tae - Cheonan KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-chip package and method of manufacturing the same Grant 9,252,123 - Han , et al. February 2, 2	2016-02-02
Multi-chip Package And Method Of Manufacturing The Same App 20150031149 - HAN; Won-Gil ; et al.	2015-01-29
Package Substrate And Semiconductor Package Including The Same App 20140191397 - KANG; Tae-Gyu ; et al.	2014-07-10
Apparatus And Method For Reducing Residual Stress Of Semiconductor App 20140193984 - PARK; Jae Dong ; et al.	2014-07-10
Package substrate and semiconductor package including the same Grant 8,698,311 - Kang , et al. April 15, 2	2014-04-15
Method for processing a substrate using a laser beam Grant 8,466,074 - Cho , et al. June 18, 2	2013-06-18
Multi-chip Package And Method Of Manufacturing The Same App 20130093080 - HAN; Won-Gil ; et al.	2013-04-18
Package Substrate And Semiconductor Package Including The Same App 20130069229 - KANG; Tae-Gyu ; et al.	2013-03-21
Method For Processing A Substrate Using A Laser Beam App 20110256736 - Cho; Sung-il ; et al.	2011-10-20
Thin printed circuit board for manufacturing chip scale package Grant 7,502,231 - Hwang , et al. March 10, 2	2009-03-10
In-line System And Method For Manufacturing A Semiconductor Package App 20090028671 - Jin; Ho-Tae ; et al.	2009-01-29
Semiconductor Package With Redistribution Layer Of Semiconductor Chip Directly Contacted With Substrate And Method Of Fabricating The Same App 20080142945 - HA; Seung-Weon ; et al.	2008-06-19
Thin Printed Circuit Board For Manufacturing Chip Scale Package App 20080083561 - Hwang; Yi-Sung ; et al.	2008-04-10
Thin printed circuit board for manufacturing chip scale package Grant 7,323,642 - Hwang , et al. January 29, 2	2008-01-29
Thin printed circuit board for manufacturing chip scale package App 20050011668 - Hwang, Yi-Sung ; et al.	2005-01-20
Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor package App 20040224439 - Jin, Ho-tae ; et al.	2004-11-11
Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor package Grant 6,787,393 - Jin , et al. September 7, 2	2004-09-07
Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor package App 20030189250 - Jin, Ho-Tae ; et al.	2003-10-09
Semiconductor die pickup method that prevents electrostatic discharge Grant 6,386,432 - Jin , et al. May 14, 2	2002-05-14
Die collet for a semiconductor chip and apparatus for bonding semiconductor chip to a lead frame Grant 6,321,971 - Jin , et al. November 27, 2	2001-11-27
Chip separation device and method Grant 6,121,118 - Jin , et al. September 19, 2	2000-09-19
Semiconductor die bonding apparatus having multiple bonding system Grant 5,979,739 - Jin , et al. November 9, 1	1999-11-09

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