| Patent | Date |
|---|
Method of plasma etching of high-K dielectric materials
Grant 7,838,434 - Jin , et al. November 23, 2 | 2010-11-23 |
Etch methods to form anisotropic features for high aspect ratio applications
Grant 7,368,394 - Shen , et al. May 6, 2 | 2008-05-06 |
Etch Methods To Form Anisotropic Features For High Aspect Ratio Applications
App 20080057729 - Shen; Meihua ; et al. | 2008-03-06 |
Etch methods to form anisotropic features for high aspect ratio applications
App 20070202700 - Leucke; Uwe ; et al. | 2007-08-30 |
Etch methods to form anisotropic features for high aspect ratio applications
App 20070199922 - Shen; Meihua ; et al. | 2007-08-30 |
Method of plasma etching high-K dielectric materials with high selectivity to underlying layers
Grant 7,217,665 - Nallan , et al. May 15, 2 | 2007-05-15 |
Method Of Plasma Etching Of High-k Dielectric Materials
App 20070077767 - Jin; Guangxiang ; et al. | 2007-04-05 |
Etching high-kappa dielectric materials with good high-kappa foot control and silicon recess control
App 20060252265 - Jin; Guangxiang ; et al. | 2006-11-09 |
Method of plasma etching of high-K dielectric materials
Grant 7,094,704 - Jin , et al. August 22, 2 | 2006-08-22 |
Method of etching metals with high selectivity to hafnium-based dielectric materials
App 20060060565 - Nallan; Padmapani C. ; et al. | 2006-03-23 |
Method of preventing short circuits in magnetic film stacks
Grant 6,893,893 - Nallan , et al. May 17, 2 | 2005-05-17 |
Etching methods for a magnetic memory cell stack
Grant 6,821,907 - Hwang , et al. November 23, 2 | 2004-11-23 |
Method of etching metals with high selectivity to hafnium-based dielectric materials
App 20040206724 - Nallan, Padmapani C. ; et al. | 2004-10-21 |
Method of plasma etching of high-K dielectric materials with high selectivity to underlying layers
Grant 6,806,095 - Nallan , et al. October 19, 2 | 2004-10-19 |
Method of plasma etching of high-K dielectric materials with high selectivity to underlying layers
App 20040173572 - Nallan, Padmapani C. ; et al. | 2004-09-09 |
Method of etching metallic materials to form a tapered profile
App 20040171272 - Jin, Guangxiang ; et al. | 2004-09-02 |
Method of fabricating a gate structure of a field effect transistor using an alpha-carbon mask
Grant 6,767,824 - Nallan , et al. July 27, 2 | 2004-07-27 |
Method of etching high-K dielectric materials
App 20040132311 - Nallan, Padmapani C. ; et al. | 2004-07-08 |
Method of plasma etching high-K dielectric materials with high selectivity to underlying layers
App 20040097092 - Nallan, Padmapani C. ; et al. | 2004-05-20 |
Method of forming a cup capacitor
Grant 6,730,561 - Hwang , et al. May 4, 2 | 2004-05-04 |
Method of fabricating a gate structure of a field effect transistor using an alpha-carbon mask
App 20040058517 - Nallan, Padmapani C. ; et al. | 2004-03-25 |
Substrate cleaning apparatus and method
Grant 6,692,903 - Chen , et al. February 17, 2 | 2004-02-17 |
Method for plasma etching of high-K dielectric materials
App 20040007561 - Nallan, Padmapani ; et al. | 2004-01-15 |
Method of plasma etching of high-K dielectric materials
App 20030211748 - Jin, Guangxiang ; et al. | 2003-11-13 |
Method of preventing short circuits in magnetic film stacks
App 20030180968 - Nallan, Padmapani C. ; et al. | 2003-09-25 |
Method of plasma etching of high-K dielectric materials with high selectivity to underlying layers
App 20030170986 - Nallan, Padmapani C. ; et al. | 2003-09-11 |
Etching methods for a magnetic memory cell stack
App 20030170985 - Hwang, Jeng H. ; et al. | 2003-09-11 |
Method of forming a cup capacitor
App 20030013252 - Hwang, Jeng H. ; et al. | 2003-01-16 |
Substrate cleaning apparatus and method
App 20020072016 - Chen, Haojiang ; et al. | 2002-06-13 |
| 