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Patent applications and USPTO patent grants for Jin; Chua Soo.The latest application filed is for "encapsulation of electronic devices".
Patent | Date |
---|---|
Organic electronic devices with an encapsulation Grant 8,344,360 - Auch , et al. January 1, 2 | 2013-01-01 |
Encapsulation of electronic devices Grant 7,394,153 - Auch , et al. July 1, 2 | 2008-07-01 |
Encapsulation of electronic devices Grant 7,166,007 - Auch , et al. January 23, 2 | 2007-01-23 |
Sealing for OLED devices Grant 6,933,537 - Yee , et al. August 23, 2 | 2005-08-23 |
Encapsulation of electronic devices App 20050064780 - Auch, Mark ;   et al. | 2005-03-24 |
Procedure for encapsulation of electronic devices Grant 6,803,245 - Auch , et al. October 12, 2 | 2004-10-12 |
Support for bending test of flexible substrates Grant 6,776,050 - Auch , et al. August 17, 2 | 2004-08-17 |
Barrier stack Grant 6,737,753 - Kumar , et al. May 18, 2 | 2004-05-18 |
Encapsulation Of Electronic Devices App 20030094691 - Auch, Mark ;   et al. | 2003-05-22 |
Sealing for OLED devices App 20030062533 - Yee, Low Hong ;   et al. | 2003-04-03 |
Method for encapsulation of electronic devices App 20030062518 - Auch, Mark ;   et al. | 2003-04-03 |
Procedure for encapsulation of electronic devices App 20030064540 - Auch, Mark ;   et al. | 2003-04-03 |
Support for bending test of flexible substrates App 20030061885 - Auch, Mark ;   et al. | 2003-04-03 |
Barrier stack App 20030062527 - Kumar, Senthil ;   et al. | 2003-04-03 |
Buried hetero-structure InP-based opto-electronic device with native oxidized current blocking layer Grant 6,287,884 - Jie , et al. September 11, 2 | 2001-09-11 |
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