Jin; Chia-Yu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jin; Chia-Yu.The latest application filed is for "semiconductor package having discrete antenna device".
- Jin; Chia-Yu - Hsinchu City TW
- Jin; Chia-Yu - Hsin-Chu TW
- Jin; Chia-Yu - Hsinchu County N/A TW
| Patent | Date |
|---|---|
| Semiconductor Package Having Discrete Antenna Device App 20200303806 - Wu; Wen-Chou ; et al. | 2020-09-24 |
| Fan-out package structure having stacked carrier substrates and method for forming the same Grant 10,515,887 - Syu , et al. Dec | 2019-12-24 |
| Fan-out Package Structure Having Stacked Carrier Substrates And Method For Forming The Same App 20180082936 - SYU; Shih-Yi ; et al. | 2018-03-22 |
| Semiconductor package structure and manufacturing method thereof Grant 8,404,501 - Huang , et al. March 26, 2 | 2013-03-26 |
| Semiconductor Package Structure And Manufacturing Method Thereof App 20120138961 - Huang; Po-Yao ; et al. | 2012-06-07 |
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