loadpatents
name:-0.0064270496368408
name:-0.012192010879517
name:-0.00046801567077637
Jimarez; Miguel Angel Patent Filings

Jimarez; Miguel Angel

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jimarez; Miguel Angel.The latest application filed is for "x-ray alignment system for fabricating electronic chips".

Company Profile
0.12.4
  • Jimarez; Miguel Angel - Gilbert AZ
  • Jimarez, Miguel Angel - Newark Valley NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Exposed die overmolded flip chip package and fabrication method
Grant 8,847,372 - Darveaux , et al. September 30, 2
2014-09-30
Exposed die overmolded flip chip package and fabrication method
Grant 8,541,260 - Darveaux , et al. September 24, 2
2013-09-24
Exposed die overmolded flip chip package and fabrication method
Grant 8,476,748 - Darveaux , et al. July 2, 2
2013-07-02
Exposed die overmolded flip chip package
Grant 8,368,194 - Darveaux , et al. February 5, 2
2013-02-05
Exposed die overmolded flip chip package method
Grant 8,207,022 - Darveaux , et al. June 26, 2
2012-06-26
Exposed die overmolded flip chip package and fabrication method
Grant 7,898,093 - Darveaux , et al. March 1, 2
2011-03-01
X-Ray Alignment System For Fabricating Electronic Chips
App 20080043909 - Jimarez; Miguel Angel
2008-02-21
X-ray alignment system for fabricating electronic chips
Grant 7,270,478 - Jimarez September 18, 2
2007-09-18
X-ray alignment system for fabricating electronic chips
App 20050194427 - Jimarez, Miguel Angel
2005-09-08
X-ray alignment system for fabricaing electronic chips
App 20040032931 - Jimarez, Miguel Angel
2004-02-19
Flip chip C4 extension structure and process
Grant 6,664,637 - Jimarez , et al. December 16, 2
2003-12-16
Flip chip C4 extension structure and process
App 20010005047 - Jimarez, Miguel Angel ;   et al.
2001-06-28
Flip chip C4 extension structure and process
Grant 6,225,206 - Jimarez , et al. May 1, 2
2001-05-01
Solder hierarchy for chip attachment to substrates
Grant 5,729,440 - Jimarez , et al. March 17, 1
1998-03-17
Solder hierarchy for chip attachment to substrates
Grant 5,655,703 - Jimarez , et al. August 12, 1
1997-08-12

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