Jimarez; Miguel A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jimarez; Miguel A..The latest application filed is for "method for forming a plated microvia interconnect".
- Jimarez; Miguel A. - Newark Valley NY
| Patent | Date |
|---|---|
| Method of forming printed circuit card Grant 7,353,590 - Fallon , et al. April 8, 2 | 2008-04-08 |
| Method for forming a plated microvia interconnect Grant 7,328,506 - Jimarez , et al. February 12, 2 | 2008-02-12 |
| Method For Forming A Plated Microvia Interconnect App 20080017410 - Jimarez; Miguel A. ; et al. | 2008-01-24 |
| Method of making an electronic package App 20070278654 - Jimarez; Lisa J. ; et al. | 2007-12-06 |
| Method of making an electronic package Grant 7,278,207 - Jimarez , et al. October 9, 2 | 2007-10-09 |
| Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers Grant 6,989,607 - Darbha , et al. January 24, 2 | 2006-01-24 |
| Method of forming printed circuit card Grant 6,986,198 - Fallon , et al. January 17, 2 | 2006-01-17 |
| Method of forming printed circuit card App 20060005383 - Fallon; Kenneth ; et al. | 2006-01-12 |
| Method of making an electronic package App 20050250249 - Jimarez, Lisa J. ; et al. | 2005-11-10 |
| Method of making an electronic package Grant 6,961,995 - Jimarez , et al. November 8, 2 | 2005-11-08 |
| Flip chip C4 extension structure and process Grant 6,955,982 - Jimarez , et al. October 18, 2 | 2005-10-18 |
| Reduction of chip carrier flexing during thermal cycling Grant 6,818,972 - Jimarez , et al. November 16, 2 | 2004-11-16 |
| Two signal one power plane circuit board App 20040134685 - Fallon, Kenneth ; et al. | 2004-07-15 |
| Method of forming a chip assembly Grant 6,757,967 - Jimarez , et al. July 6, 2 | 2004-07-06 |
| Flip chip C4 extension structure and process Grant 6,756,680 - Jimarez , et al. June 29, 2 | 2004-06-29 |
| Two signal one power plane circuit board Grant 6,750,405 - Fallon , et al. June 15, 2 | 2004-06-15 |
| Flip chip C4 extension structure and process App 20040094842 - Jimarez, Miguel A. ; et al. | 2004-05-20 |
| Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers App 20040021205 - Darbha, Krishna ; et al. | 2004-02-05 |
| Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries Grant 6,639,302 - Darbha , et al. October 28, 2 | 2003-10-28 |
| Stress Reduction In Flip-chip Pbga Packaging By Utilizing Segmented Chip Carriers App 20030178649 - Darbha, Krishna ; et al. | 2003-09-25 |
| Method and structure for joining two substrates with a low melt solder joint Grant 6,583,517 - Jimarez June 24, 2 | 2003-06-24 |
| Laminate having plated microvia interconnects and method for forming the same App 20030102158 - Jimarez, Miguel A. ; et al. | 2003-06-05 |
| Method for making an encapsulated semiconductor chip module Grant 6,558,981 - Jimarez , et al. May 6, 2 | 2003-05-06 |
| Method of attaching a conformal chip carrier to a flip chip Grant 6,524,888 - Cokely , et al. February 25, 2 | 2003-02-25 |
| Reduction of chip carrier flexing during thermal cycling App 20030034566 - Jimarez, Lisa J. ; et al. | 2003-02-20 |
| Compliant layer for encapsulated columns App 20030020150 - Jimarez, Lisa J. ; et al. | 2003-01-30 |
| Surface metal balancing to reduce chip carrier flexing Grant 6,497,943 - Jimarez , et al. December 24, 2 | 2002-12-24 |
| I/C chip assembly and method of forming same App 20020108768 - Jimarez, Lisa J. ; et al. | 2002-08-15 |
| Method and apparatus for assembling a conformal chip carrier to a flip chip App 20020096746 - Cokely, David N. ; et al. | 2002-07-25 |
| Compliant layer for encapsulated cloumns App 20020092676 - Jimarez, Lisa J. ; et al. | 2002-07-18 |
| I/C chip assembly Grant 6,407,334 - Jimarez , et al. June 18, 2 | 2002-06-18 |
| I/c Chip Assembly App 20020062970 - Jimarez, Lisa J. ; et al. | 2002-05-30 |
| Fixture for attaching a conformal chip carrier to a flip chip Grant 6,337,509 - Cokely , et al. January 8, 2 | 2002-01-08 |
| Method for making an encapsulated semiconductor chip module App 20010026959 - Jimarez, Miguel A. ; et al. | 2001-10-04 |
| Method And Apparatus For Assembling A Conformal Chip Carrier To A Flip Chip App 20010019174 - COKELY, DAVID N. ; et al. | 2001-09-06 |
| Flip chip C4 extension structure and process App 20010018230 - Jimarez, Miguel A. ; et al. | 2001-08-30 |
| Two signal one power plane circuit board Grant 6,204,453 - Fallon , et al. March 20, 2 | 2001-03-20 |
| Rework process for semiconductor chips mounted in a flip chip configuration on an organic substrate Grant 5,542,601 - Fallon , et al. August 6, 1 | 1996-08-06 |
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