Jimarez; Lisa J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jimarez; Lisa J..The latest application filed is for "method of making an electronic package".
- Jimarez; Lisa J. - Newark Valley NY
- Jimarez; Lisa J. - Chandler AZ
| Patent | Date |
|---|---|
| Z interconnect structure and method Grant 7,718,902 - Jimarez , et al. May 18, 2 | 2010-05-18 |
| Method of making an electronic package App 20070278654 - Jimarez; Lisa J. ; et al. | 2007-12-06 |
| Method for producing Z-axis interconnection assembly of printed wiring board elements Grant 7,303,639 - Curcio , et al. December 4, 2 | 2007-12-04 |
| Method of making an electronic package Grant 7,278,207 - Jimarez , et al. October 9, 2 | 2007-10-09 |
| Method for producing Z-axis interconnection assembly of printed wiring board elements App 20050280136 - Curcio, Brian E. ; et al. | 2005-12-22 |
| Method and structure for producing Z-axis interconnection assembly of printed wiring board elements Grant 6,969,436 - Curcio , et al. November 29, 2 | 2005-11-29 |
| Method of making an electronic package App 20050250249 - Jimarez, Lisa J. ; et al. | 2005-11-10 |
| Method of making an electronic package Grant 6,961,995 - Jimarez , et al. November 8, 2 | 2005-11-08 |
| Z interconnect structure and method App 20050051608 - Jimarez, Lisa J. ; et al. | 2005-03-10 |
| Optical assemblies for transmitting and manipulating optical beams Grant 6,836,015 - Denneau , et al. December 28, 2 | 2004-12-28 |
| Reduction of chip carrier flexing during thermal cycling Grant 6,818,972 - Jimarez , et al. November 16, 2 | 2004-11-16 |
| Optical Assemblies For Transmitting And Manipulating Optical Beams App 20040217464 - Denneau, Monty M. ; et al. | 2004-11-04 |
| Z interconnect structure and method Grant 6,805,280 - Jimarez , et al. October 19, 2 | 2004-10-19 |
| Method of forming a chip assembly Grant 6,757,967 - Jimarez , et al. July 6, 2 | 2004-07-06 |
| Metal backed printed circuit board assemblies Grant 6,734,368 - Jimarez , et al. May 11, 2 | 2004-05-11 |
| Method and structure for producing Z-axis interconnection assembly of printed wiring board elements App 20040084137 - Curcio, Brian E. ; et al. | 2004-05-06 |
| Method and structure for producing Z-axis interconnection assembly of printed wiring board elements Grant 6,638,607 - Curcio , et al. October 28, 2 | 2003-10-28 |
| High performance packaging platform and method of making same Grant 6,639,155 - Bupp , et al. October 28, 2 | 2003-10-28 |
| Z interconnect structure and method App 20030127247 - Jimarez, Lisa J. ; et al. | 2003-07-10 |
| Method of attaching a conformal chip carrier to a flip chip Grant 6,524,888 - Cokely , et al. February 25, 2 | 2003-02-25 |
| Reduction of chip carrier flexing during thermal cycling App 20030034566 - Jimarez, Lisa J. ; et al. | 2003-02-20 |
| Hybrid surface mount and pin thru hole circuit board Grant 6,521,842 - Brinthaupt, III , et al. February 18, 2 | 2003-02-18 |
| Compliant layer for encapsulated columns App 20030020150 - Jimarez, Lisa J. ; et al. | 2003-01-30 |
| Hybrid Surface Mount And Pin Thru Hole Circuit Board App 20030006061 - Brinthaupt, Mark R. III ; et al. | 2003-01-09 |
| Surface metal balancing to reduce chip carrier flexing Grant 6,497,943 - Jimarez , et al. December 24, 2 | 2002-12-24 |
| I/C chip assembly and method of forming same App 20020108768 - Jimarez, Lisa J. ; et al. | 2002-08-15 |
| Method and apparatus for assembling a conformal chip carrier to a flip chip App 20020096746 - Cokely, David N. ; et al. | 2002-07-25 |
| Compliant layer for encapsulated cloumns App 20020092676 - Jimarez, Lisa J. ; et al. | 2002-07-18 |
| I/C chip assembly Grant 6,407,334 - Jimarez , et al. June 18, 2 | 2002-06-18 |
| I/c Chip Assembly App 20020062970 - Jimarez, Lisa J. ; et al. | 2002-05-30 |
| Integrated circuit chip carrier assembly App 20020038913 - Farquhar, Donald S. ; et al. | 2002-04-04 |
| Fixture for attaching a conformal chip carrier to a flip chip Grant 6,337,509 - Cokely , et al. January 8, 2 | 2002-01-08 |
| Method And Apparatus For Assembling A Conformal Chip Carrier To A Flip Chip App 20010019174 - COKELY, DAVID N. ; et al. | 2001-09-06 |
| Method and apparatus for insulating moisture sensitive PBGA's Grant 6,059,170 - Jimarez , et al. May 9, 2 | 2000-05-09 |
| Depositing a conductive metal onto a substrate Grant 5,509,557 - Jimarez , et al. April 23, 1 | 1996-04-23 |
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