| Patent | Date |
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Chronic Disease Prediction System Based On Multi-task Learning Model
App 20220254493 - WU; JIAN ; et al. | 2022-08-11 |
Image sensor and manufacturing method thereof
App 20220165895 - Zhan; Zhaoyao ; et al. | 2022-05-26 |
Bike saddle
Grant D949,584 - Jiang April 26, 2 | 2022-04-26 |
Photosensitive Device
App 20210384231 - Zhan; Zhaoyao ; et al. | 2021-12-09 |
Bike saddle
Grant D930,375 - Jiang September 14, 2 | 2021-09-14 |
Gate-all-around (GAA) transistor and method of fabricating the same
Grant 11,101,361 - Zhan , et al. August 24, 2 | 2021-08-24 |
Method for stabilizing bandgap voltage
Grant 10,909,299 - Pang , et al. February 2, 2 | 2021-02-02 |
Chinese Medicine Production Process Knowledge System
App 20200350058 - XIAO; Wei ; et al. | 2020-11-05 |
Package Design Scheme For Enabling High-speed Low-loss Signaling And Mitigation Of Manufacturing Risk And Cost
App 20200343202 - WANG; Lijiang ; et al. | 2020-10-29 |
Magnetically decoupled inductor structures
Grant 9,941,201 - Jiang , et al. April 10, 2 | 2018-04-10 |
Tranmission line bridge interconnects
Grant 9,842,813 - Jiang , et al. December 12, 2 | 2017-12-12 |
Tranmission Line Bridge Interconnects
App 20170084553 - Jiang; Xiaohong ; et al. | 2017-03-23 |
Integrated circuit package routing with reduced crosstalk
Grant 9,425,149 - Jiang , et al. August 23, 2 | 2016-08-23 |
IC package with non-uniform dielectric layer thickness
Grant 9,401,330 - Jiang , et al. July 26, 2 | 2016-07-26 |
Multilayer integrated circuit packages with localized air structures
Grant 9,331,370 - Jiang May 3, 2 | 2016-05-03 |
Integrated circuit package with reduced pad capacitance
Grant 9,245,835 - Jiang , et al. January 26, 2 | 2016-01-26 |
High performance PCB
Grant 8,841,561 - Jiang , et al. September 23, 2 | 2014-09-23 |
Apparatus For Electronic Assembly With Improved Interconnect And Associated Methods
App 20140264783 - Liu; Hui ; et al. | 2014-09-18 |
Compensation network using an on-die compensation inductor
Grant 8,723,293 - Jiang , et al. May 13, 2 | 2014-05-13 |
Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packages
Grant 8,502,386 - Jiang , et al. August 6, 2 | 2013-08-06 |
Compensation network using an on-die compensation inductor
Grant 8,368,174 - Jiang , et al. February 5, 2 | 2013-02-05 |
Interconnect pattern for transceiver package
Grant 8,294,259 - Jiang , et al. October 23, 2 | 2012-10-23 |
Interconnect Pattern For Transceiver Package
App 20110193233 - Jiang; Xiaohong ; et al. | 2011-08-11 |
Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packages
Grant 7,752,587 - Jiang , et al. July 6, 2 | 2010-07-06 |
Vertically Tapered Transmission Line for Optimal Signal Transition in High-Speed Multi-Layer Ball Grid Array Packages
App 20100148375 - Jiang; Xiaohong ; et al. | 2010-06-17 |
Semiconductor device layout and channeling implant process
Grant 7,573,099 - Li , et al. August 11, 2 | 2009-08-11 |
Vertically Tapered Transmission Line For Optimal Signal Transition In High-speed Multi-layer Ball Grid Array Packages
App 20090077523 - Jiang; Xiaohong ; et al. | 2009-03-19 |
Semiconductor device layout and channeling implant process
Grant 7,253,483 - Li , et al. August 7, 2 | 2007-08-07 |
Semiconductor device layout and channeling implant process
App 20050280082 - Li, Yisuo ; et al. | 2005-12-22 |
Semiconductor device layout and channeling implant process
Grant 6,972,236 - Li , et al. December 6, 2 | 2005-12-06 |
Semiconductor device layout and channeling implant process
App 20050236677 - Li, Yisuo ; et al. | 2005-10-27 |
Semiconductor Device Layout And Channeling Implant Process
App 20050170595 - Li, Yisuo ; et al. | 2005-08-04 |
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