JIANG; Wenfan
Patent Applications and Registrations
Patent applications and USPTO patent grants for JIANG; Wenfan.The latest application filed is for "switchable vibration modal ultrasonic device and method based on same".
- JIANG; Wenfan - Zhenjiang CN
- Jiang; Wenfan - Jiangsu CN
- JIANG; Wenfan - Jingkou Zhenjiang Jiangsu
| Patent | Date |
|---|---|
| Switchable Vibration Modal Ultrasonic Device And Method Based On Same App 20220096322 - JIANG; Wenfan ; et al. | 2022-03-31 |
| Laser Shock And Supersonic Vibration Extrusion Co-strengthening Device And Method App 20210371950 - JIANG; Yinfang ; et al. | 2021-12-02 |
| Laser Shock Strengthening Method For Small-hole Components With Different Thicknesses App 20210363605 - Jiang; Yinfang ; et al. | 2021-11-25 |
| Connecting rod ultrasonic-assisted splitting machining method and machining device thereof Grant 10,899,037 - Jiang , et al. January 26, 2 | 2021-01-26 |
| Connecting Rod Ultrasonic-assisted Splitting Machining Method And Machining Device Thereof App 20200031012 - JIANG; Yinfang ; et al. | 2020-01-30 |
| Method for manufacturing composite double-metal fracture splitting connecting rod Grant 9,695,866 - Jiang , et al. July 4, 2 | 2017-07-04 |
| Method For Manufacturing Composite Double-metal Fracture Splitting Connecting Rod App 20150053363 - Jiang; Wenfan ; et al. | 2015-02-26 |
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