Jiang; Tongbi T.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jiang; Tongbi T..The latest application filed is for "blood pressure monitoring system including a liquid filled sensor".
- Jiang; Tongbi T. - Santa Clara CA
- Jiang; Tongbi T. - Cupertino CA
| Patent | Date |
|---|---|
| Exposed wire-bonding for sensing liquid and water in electronic devices Grant 11,422,104 - Han , et al. August 23, 2 | 2022-08-23 |
| Blood Pressure Monitoring System Including a Liquid Filled Sensor App 20220240803 - Han; Caleb C. ; et al. | 2022-08-04 |
| Optical Sensor Package with Magnetic Component for Device Attachment App 20220085231 - Liu; Saijin ; et al. | 2022-03-17 |
| Display Systems Having Monolithic Arrays of Light-Emitting Diodes App 20220005798 - Qi; Jun ; et al. | 2022-01-06 |
| Edge-mountable semiconductor chip package Grant 11,211,515 - Jiang , et al. December 28, 2 | 2021-12-28 |
| Exposed Wire-bonding For Sensing Liquid And Water In Electronic Devices App 20210072176 - Han; Caleb C. ; et al. | 2021-03-11 |
| Edge-Mountable Semiconductor Chip Package App 20200274020 - Jiang; Tongbi T. ; et al. | 2020-08-27 |
| VCSEL structure with embedded heat sink Grant 10,454,241 - Jiang , et al. Oc | 2019-10-22 |
| VCSEL structure with embedded heat sink App 20190181610 - Jiang; Tongbi T. ; et al. | 2019-06-13 |
| VCSEL structure with embedded heat sink Grant 10,103,512 - Jiang , et al. October 16, 2 | 2018-10-16 |
| VCSEL structure with embedded heat sink App 20180048115 - Jiang; Tongbi T. ; et al. | 2018-02-15 |
| VCSEL structure with embedded heat sink Grant 9,735,539 - Jiang , et al. August 15, 2 | 2017-08-15 |
| Integrated Mems Microphone And Vibration Sensor App 20170156002 - Han; Caleb C. ; et al. | 2017-06-01 |
| Vcsel Structure With Embedded Heat Sink App 20170025815 - Jiang; Tongbi T. ; et al. | 2017-01-26 |
| Preventing artifacts due to underfill in flip chip imager assembly Grant 9,503,622 - Jiang , et al. November 22, 2 | 2016-11-22 |
| Curved Light Sensor App 20160050379 - Jiang; Tongbi T. ; et al. | 2016-02-18 |
| Flexible Printed Circuit With Semiconductor Strain Gauge App 20150296622 - Jiang; Tongbi T. ; et al. | 2015-10-15 |
| Electronic Device With Flexible Printed Circuit Strain Gauge Sensor App 20150296607 - Yang; Henry H. ; et al. | 2015-10-15 |
| Preventing Artifacts Due To Underfill In Flip Chip Imager Assembly App 20150256725 - Jiang; Tongbi T. ; et al. | 2015-09-10 |
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