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Anomaly detection using image-based physical characterization
Grant 11,282,186 - Guo , et al. March 22, 2 | 2022-03-22 |
Fabrication of logic devices and power devices on the same substrate
Grant 11,244,869 - Li , et al. February 8, 2 | 2022-02-08 |
Self aligned block masks for implantation control
Grant 11,177,132 - Wang , et al. November 16, 2 | 2021-11-16 |
Precise junction placement in vertical semiconductor devices using etch stop layers
Grant 11,088,278 - Bu , et al. August 10, 2 | 2021-08-10 |
Fuse element resistance enhancement by laser anneal and ion implantation
Grant 10,903,162 - Jiang , et al. January 26, 2 | 2021-01-26 |
Self Aligned Block Masks For Implantation Control
App 20210005459 - Wang; Junli ; et al. | 2021-01-07 |
Self-aligned tunneling field effect transistors
Grant 10,833,180 - Song , et al. November 10, 2 | 2020-11-10 |
Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size
Grant 10,811,599 - Clevenger , et al. October 20, 2 | 2020-10-20 |
Fuse Element Resistance Enhancement By Laser Anneal And Ion Implantation
App 20200286827 - Jiang; Liying ; et al. | 2020-09-10 |
Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size
Grant 10,756,260 - Clevenger , et al. A | 2020-08-25 |
Fabrication Of Logic Devices And Power Devices On The Same Substrate
App 20200258790 - A1 | 2020-08-13 |
Anomaly Detection Using Image-based Physical Characterization
App 20200219247 - Guo; Dechao ; et al. | 2020-07-09 |
Fabrication of logic devices and power devices on the same substrate
Grant 10,685,886 - Li , et al. | 2020-06-16 |
Anomaly detection using image-based physical characterization
Grant 10,664,966 - Guo , et al. | 2020-05-26 |
Self-aligned Tunneling Field Effect Transistors
App 20200119168 - Song; Yi ; et al. | 2020-04-16 |
Co-fabrication Of Magnetic Device Structures With Electrical Interconnects Having Reduced Resistance Through Increased Conductor
App 20190280196 - Clevenger; Lawrence A. ; et al. | 2019-09-12 |
Co-fabrication Of Magnetic Device Structures With Electrical Interconnects Having Reduced Resistance Through Increased Conductor
App 20190273204 - Clevenger; Lawrence A. ; et al. | 2019-09-05 |
Anomaly Detection Using Image-based Physical Characterization
App 20190228519 - Guo; Dechao ; et al. | 2019-07-25 |
Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size
Grant 10,361,364 - Clevenger , et al. | 2019-07-23 |
Fabrication Of Logic Devices And Power Devices On The Same Substrate
App 20190189521 - Li; Juntao ; et al. | 2019-06-20 |
Precise Junction Placement In Vertical Semiconductor Devices Using Etch Stop Layers
App 20190148545 - Bu; Huiming ; et al. | 2019-05-16 |
Precise junction placement in vertical semiconductor devices using etch stop layers
Grant 10,249,754 - Bu , et al. | 2019-04-02 |
Precise junction placement in vertical semiconductor devices using etch stop layers
Grant 10,224,429 - Bu , et al. | 2019-03-05 |
Co-fabrication Of Magnetic Device Structures With Electrical Interconnects Having Reduced Resistance Through Increased Conductor Grain Size
App 20180366640 - Clevenger; Lawrence A. ; et al. | 2018-12-20 |
Precise Junction Placement In Vertical Semiconductor Devices Using Etch Stop Layers
App 20180182892 - Bu; Huiming ; et al. | 2018-06-28 |
Precise junction placement in vertical semiconductor devices using etch stop layers
Grant 9,954,101 - Bu , et al. April 24, 2 | 2018-04-24 |
Precise Junction Placement In Vertical Semiconductor Devices Using Etch Stop Layers
App 20170365714 - Bu; Huiming ; et al. | 2017-12-21 |
Precise Junction Placement In Vertical Semiconductor Devices Using Etch Stop Layers
App 20170365712 - Bu; Huiming ; et al. | 2017-12-21 |
Configuration of multiple database audits
Grant 8,069,148 - Richins , et al. November 29, 2 | 2011-11-29 |
Configuration Of Multiple Database Audits
App 20090282083 - Richins; Jack S. ; et al. | 2009-11-12 |
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