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Patent applications and USPTO patent grants for Jiang; Hunt H..The latest application filed is for "sandwich structure with double-sided cooling and emi shielding".
Patent | Date |
---|---|
Sandwich structure with double-sided cooling and EMI shielding Grant 8,064,202 - Yin , et al. November 22, 2 | 2011-11-22 |
Sandwich Structure With Double-sided Cooling And Emi Shielding App 20110205709 - Yin; Jian ;   et al. | 2011-08-25 |
Method and flip chip structure for power devices Grant 7,999,364 - Jiang August 16, 2 | 2011-08-16 |
Chip scale package for power devices and method for making the same Grant 7,944,048 - Jiang May 17, 2 | 2011-05-17 |
Multi-die Package With Improved Heat Dissipation App 20100252918 - Jiang; Hunt H. ;   et al. | 2010-10-07 |
Method And Flip Chip Structure For Power Devices App 20080048218 - Jiang; Hunt H. | 2008-02-28 |
Chip Scale Package For Power Devices And Method For Making The Same App 20080035959 - Jiang; Hunt H. | 2008-02-14 |
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