Jiang; Hong Jin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jiang; Hong Jin.The latest application filed is for "methods of forming vias in multilayer substrates".
- Jiang; Hong Jin - Singapore SG
| Patent | Date |
|---|---|
| Methods of forming vias in multilayer substrates Grant 7,361,593 - Freeman , et al. April 22, 2 | 2008-04-22 |
| Magnetically controlled heat sink Grant 7,308,008 - Freeman , et al. December 11, 2 | 2007-12-11 |
| Low temperature bonding of multilayer substrates Grant 7,259,466 - Freeman , et al. August 21, 2 | 2007-08-21 |
| Methods of forming vias in multilayer substrates App 20050285172 - Freeman, William R. ; et al. | 2005-12-29 |
| Control system for electrochromic devices Grant 6,940,627 - Freeman , et al. September 6, 2 | 2005-09-06 |
| Magnetically controlled heat sink App 20050169328 - Freeman, William R. ; et al. | 2005-08-04 |
| Thermoelectric modules and methods of manufacture App 20050045702 - Freeman, William ; et al. | 2005-03-03 |
| Control system for electrochromic devices App 20050046920 - Freeman, William ; et al. | 2005-03-03 |
| Photopolymerizable electrolyte layers for electrochromic windows App 20050024705 - Freeman, William ; et al. | 2005-02-03 |
| Low temperature bonding of multilayer substrates App 20050011669 - Freeman, William ; et al. | 2005-01-20 |
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