Jiang; Don-Son
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jiang; Don-Son.The latest application filed is for "electronic package and fabrication method thereof".
- Jiang; Don-Son - Taichung TW
- Jiang; Don-Son - Taichung City TW
- Jiang; Don-Son - Taichung Hsien TW
| Patent | Date |
|---|---|
| Electronic package and manufacturing method thereof Grant 11,398,429 - Chang , et al. July 26, 2 | 2022-07-26 |
| Electronic Package And Fabrication Method Thereof App 20220189900 - Kuo; Chia-Yu ; et al. | 2022-06-16 |
| Electronic Package And Manufacturing Method Thereof App 20220181225 - Chen; Chi-Jen ; et al. | 2022-06-09 |
| Electronic Package And Fabrication Method Thereof App 20220173052 - Hsu; Chih-Hsun ; et al. | 2022-06-02 |
| Electronic Package And Manufacturing Method Thereof App 20220148975 - Chen; Wei-Jhen ; et al. | 2022-05-12 |
| Electronic Package And Manufacturing Method Thereof App 20220093518 - Chang; Cheng Kai ; et al. | 2022-03-24 |
| Package Stack Structure, Method For Fabricating The Same, And Carrier Component App 20200328142 - Jiang; Don-Son ; et al. | 2020-10-15 |
| Fabrication method of semiconductor package Grant 10,163,662 - Chiang , et al. Dec | 2018-12-25 |
| Electronic module Grant 10,115,712 - Hu , et al. October 30, 2 | 2018-10-30 |
| Fabrication Method Of Semiconductor Package App 20170207104 - Chiang; Cheng-Chia ; et al. | 2017-07-20 |
| Package structure having a laminated release layer and method for fabricating the same Grant 9,673,140 - Chen , et al. June 6, 2 | 2017-06-06 |
| Semiconductor package and fabrication method thereof Grant 9,646,921 - Chiang , et al. May 9, 2 | 2017-05-09 |
| Electronic Module App 20170048981 - Hu; Shao-Chueh ; et al. | 2017-02-16 |
| Package Structure And Method For Fabricating The Same App 20150287671 - Chen; Chia-Cheng ; et al. | 2015-10-08 |
| Semiconductor Package And Fabrication Method Thereof App 20150187722 - Chiang; Cheng-Chia ; et al. | 2015-07-02 |
| Package Structure And Fabrication Method Thereof App 20150102484 - Chen; Chia-Cheng ; et al. | 2015-04-16 |
| Package substrate having landless conductive traces Grant 8,304,665 - Chang , et al. November 6, 2 | 2012-11-06 |
| Package Substrate Having Landless Conductive Traces App 20090283303 - Chang; Chiang-Cheng ; et al. | 2009-11-19 |
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