Jian; Yue-Ying
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jian; Yue-Ying.The latest application filed is for "method for fabricating electronic package having a protruding barrier frame".
- Jian; Yue-Ying - Taichung TW
- Jian; Yue-Ying - Nantoa TW
- Jian; Yue-Ying - Nantou TW
| Patent | Date |
|---|---|
| Method for fabricating electronic package having a protruding barrier frame Grant 10,396,040 - Jian , et al. A | 2019-08-27 |
| Method For Fabricating Electronic Package Having A Protruding Barrier Frame App 20180261552 - Jian; Yue-Ying ; et al. | 2018-09-13 |
| Electronic package having a protruding barrier frame Grant 9,997,469 - Jian , et al. June 12, 2 | 2018-06-12 |
| Electronic Package And Method For Fabricating The Same App 20180040568 - Jian; Yue-Ying ; et al. | 2018-02-08 |
| Fluxless bumping process Grant 7,906,425 - Su , et al. March 15, 2 | 2011-03-15 |
| Fluxless bumping process App 20070028445 - Su; Chao-Yuan ; et al. | 2007-02-08 |
| Fluxless bumping process Grant 7,134,199 - Su , et al. November 14, 2 | 2006-11-14 |
| Apparatus for shear testing bonds on silicon substrate Grant 6,912,915 - Jian , et al. July 5, 2 | 2005-07-05 |
| Apparatus For Shear Testing Bonds On Silicon Substrate App 20050109117 - Jian, Yue-Ying ; et al. | 2005-05-26 |
| Fluxless bumping process App 20030229986 - Su, Chao-Yuan ; et al. | 2003-12-18 |
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