JIA; Zhaowei

Patent Applications and Registrations

Patent applications and USPTO patent grants for JIA; Zhaowei.The latest application filed is for "methods and apparatus for cleaning semiconductor wafers".

Company Profile

11.18.26

JIA; Zhaowei - Shanghai CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods And Apparatus For Cleaning Semiconductor Wafers App 20220139697 - WANG; Jun ; et al.	2022-05-05
Methods and apparatus for cleaning semiconductor wafers Grant 11,257,667 - Wang , et al. February 22, 2	2022-02-22
Methods And Apparatus For Cleaning Substrates App 20220037172 - WANG; Hui ; et al.	2022-02-03
Methods And Apparatus For Cleaning Substrates App 20220032344 - WANG; Hui ; et al.	2022-02-03
System For Cleaning Semiconductor Wafers App 20210402444 - WANG; Hui ; et al.	2021-12-30
System for cleaning semiconductor wafers Grant 11,141,762 - Wang , et al. October 12, 2	2021-10-12
Electroplating Apparatus And Electroplating Method App 20210301416 - JIA; Zhaowei ; et al.	2021-09-30
Methods and apparatus for cleaning substrates Grant 11,103,898 - Wang , et al. August 31, 2	2021-08-31
Methods and apparatus for cleaning substrates Grant 11,037,804 - Wang , et al. June 15, 2	2021-06-15
Apparatus for holding a substrate Grant 11,008,669 - Wang , et al. May 18, 2	2021-05-18
Methods And System For Cleaning Semiconductor Wafers App 20210125848 - Wang; Hui ; et al.	2021-04-29
Plating Chuck App 20210066106 - Wang; Hui ; et al.	2021-03-04
Methods and system for cleaning semiconductor wafers Grant 10,910,244 - Wang , et al. February 2, 2	2021-02-02
Plating Apparatus App 20200354851 - Jia; Zhaowei ; et al.	2020-11-12
Methods And Apparatus For Cleaning Semiconductor Wafers App 20200335325 - Wang; Jun ; et al.	2020-10-22
Method for removing barrier layer for minimizing sidewall recess Grant 10,615,073 - Jia , et al.	2020-04-07
Barrier Layer Removal Method And Semiconductor Structure Forming Method App 20190393074 - Jia; Zhaowei ; et al.	2019-12-26
Barrier layer removal method and semiconductor structure forming method Grant 10,453,743 - Jia , et al. Oc	2019-10-22
Methods And Apparatus For Cleaning Substrates App 20190287824 - Wang; Hui ; et al.	2019-09-19
Methods And Apparatus For Cleaning Substrates App 20190283090 - Wang; Hui ; et al.	2019-09-19
Method for processing interconnection structure for minimizing barrier sidewall recess Grant 10,217,662 - Jia , et al. Feb	2019-02-26
Apparatus For Holding A Substrate App 20180320285 - Wang; Hui ; et al.	2018-11-08
Method For Processing Interconnection Structure For Minimizing Barrier Sidewall Recess App 20180240701 - Jia; Zhaowei ; et al.	2018-08-23
Methods and apparatus for cleaning semiconductor wafers Grant 10,020,208 - Wang , et al. July 10, 2	2018-07-10
Methods And Apparatus For Cleaning Semiconductor Wafers App 20180151398 - Wang; Hui ; et al.	2018-05-31
Method For Cleaning Semiconductor Wafers App 20180071795 - Wang; Hui ; et al.	2018-03-15
System For Cleaning Semiconductor Wafers App 20180071794 - Wang; Hui ; et al.	2018-03-15
Method For Removing Barrier Layer For Minimizing Sidewall Recess App 20180025940 - Jia; Zhaowei ; et al.	2018-01-25
Barrier Layer Removal Method And Semiconductor Structure Forming Method App 20170221753 - Jia; Zhaowei ; et al.	2017-08-03
Methods And Apparatus For Cleaning Semiconductor Wafers App 20170140952 - Wang; Jian ; et al.	2017-05-18
Methods and apparatus for cleaning semiconductor wafers Grant 9,633,833 - Wang , et al. April 25, 2	2017-04-25
Methods and apparatus for cleaning semiconductor wafers Grant 9,595,457 - Wang , et al. March 14, 2	2017-03-14
Methods and Apparatus for Cleaning Semiconductor Wafers App 20170032959 - Wang; Jian ; et al.	2017-02-02
Method for forming interconnection structures Grant 9,496,172 - Wang , et al. November 15, 2	2016-11-15
Methods and apparatus for cleaning semiconductor wafers Grant 9,492,852 - Wang , et al. November 15, 2	2016-11-15
Method For Forming Interconnection Structures App 20150318205 - Wang; Jian ; et al.	2015-11-05
Barrier Layer Removal Method and Apparatus App 20140053978 - Wang; Jian ; et al.	2014-02-27
Barrier layer removal method and apparatus Grant 8,598,039 - Wang , et al. December 3, 2	2013-12-03
Methods and Apparatus for Cleaning Semiconductor Wafers App 20120097195 - Wang; Jian ; et al.	2012-04-26
Methods and Apparatus for Cleaning Semiconductor Wafers App 20110290277 - Wang; Jian ; et al.	2011-12-01
Barrier Layer Removal Method and Apparatus App 20110177692 - Wang; Jian ; et al.	2011-07-21

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.