Jia; Yan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jia; Yan.The latest application filed is for "online resourceful treatment method of electroless copper plating waste solution".

Company Profile

0.7.6

Jia; Yan - Guangdong CN
JIA; Yan - Guangzhou CN
Jia; Yan - Shanghai CN
Jia; Yan - Beijing CN
Jia; Yan - Haidian District Beijing N/A CN
Jia; Yan - US
Jia; Yan - Shenzhen CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Online resourceful treatment method of electroless copper plating waste solution Grant 11,345,622 - Du , et al. May 31, 2	2022-05-31
Online Resourceful Treatment Method Of Electroless Copper Plating Waste Solution App 20210323847 - DU; JianWei ; et al.	2021-10-21
Substrate and method for labeling signal lines thereof Grant 9,852,996 - Xu , et al. December 26, 2	2017-12-26
Verifying correctness of a database system via extended access paths Grant 9,195,730 - Chen , et al. November 24, 2	2015-11-24
Substrate And Method For Labeling Signal Lines Thereof App 20150179585 - XU; Wei ; et al.	2015-06-25
Dynamic database dump Grant 8,935,200 - Chen , et al. January 13, 2	2015-01-13
Dynamic Database Dump App 20120221512 - Chen; Dong Sheng ; et al.	2012-08-30
Verifying Correctness of a Database System App 20120173498 - Chen; Dong Sheng ; et al.	2012-07-05
Method of displaying 3-D avatar and system thereof Grant 7,639,251 - Gu , et al. December 29, 2	2009-12-29
Method Of Displaying 3-d Avatar And System Thereof App 20080284779 - Gu; Sibin ; et al.	2008-11-20
Method for representing virtual image on instant messaging tools App 20060075053 - Xu; Liang ; et al.	2006-04-06

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