Jia; Ningning

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jia; Ningning.The latest application filed is for "method for determining patterning device pattern based on manufacturability".

Company Profile

4.7.10

Jia; Ningning - Kunshan CN
JIA; Ningning - Shenzhen CN
JIA; Ningning - Kunshan City CN
Jia; Ningning - Jiangsu Province CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin composition and article made therefrom Grant 11,370,885 - Yao , et al. June 28, 2	2022-06-28
Method For Determining Patterning Device Pattern Based On Manufacturability App 20220050381 - BISWAS; Roshni ; et al.	2022-02-17
Resin Composition And Article Made Therefrom App 20210371657 - WANG; Rongtao ; et al.	2021-12-02
Resin Composition And Article Made Therefrom App 20210253855 - YAO; Xingxing ; et al.	2021-08-19
Resin Composition And Article Made Therefrom App 20210009759 - YAO; Xingxing ; et al.	2021-01-14
Phosphorus-containing compound, phosphorus-containing flame retardant, preparation method thereof, and article made therefrom Grant 10,676,493 - Zhang , et al.	2020-06-09
Resin composition and article made therefrom Grant 10,676,590 - Zhang , et al.	2020-06-09
Phosphorus-containing Compound, Phosphorus-containing Flame Retardant, Preparation Method Thereof, And Article Made Therefrom App 20200002365 - ZHANG; Yan ; et al.	2020-01-02
Resin Composition And Article Made Therefrom App 20190144632 - ZHANG; Yan ; et al.	2019-05-16
Resin composition, copper clad laminate and printed circuit board using same Grant 10,072,148 - Wang , et al. September 11, 2	2018-09-11
Resin Composition, Copper Clad Laminate And Printed Circuit Board Using Same App 20180072884 - WANG; Rongtao ; et al.	2018-03-15
Resin composition, copper clad laminate and printed circuit board using same Grant 9,850,375 - Wang , et al. December 26, 2	2017-12-26
Aromatic tetrafunctional vinylbenzyl resin composition and use thereof Grant 9,574,070 - Wang , et al. February 21, 2	2017-02-21
Low dissipation factor resin composition and product made thereby Grant 9,469,757 - Wang , et al. October 18, 2	2016-10-18
Resin Composition, Copper Clad Laminate And Printed Circuit Board Using Same App 20160222204 - WANG; Rongtao ; et al.	2016-08-04
Aromatic Tetrafunctional Vinylbenzyl Resin Composition And Use Thereof App 20160160008 - WANG; Rongtao ; et al.	2016-06-09
Low Dissipation Factor Resin Composition And Product Made Thereby App 20160122521 - WANG; Rongtao ; et al.	2016-05-05

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