Ji; Yun Je
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ji; Yun Je.The latest application filed is for "electronic component-embedded substrate".
- Ji; Yun Je - Suwon-si KR
| Patent | Date |
|---|---|
| Electronic component-embedded substrate Grant 11,439,020 - Ji , et al. September 6, 2 | 2022-09-06 |
| Package substrate and multi-chip package including the same Grant 11,315,879 - Ji , et al. April 26, 2 | 2022-04-26 |
| Electronic Component-embedded Substrate App 20220087025 - JI; Yun Je ; et al. | 2022-03-17 |
| Rigid-flexible printed circuit board and electronic component module Grant 11,259,404 - Hwang , et al. February 22, 2 | 2022-02-22 |
| Substrate Structure App 20220005765 - Yi; Moon Hee ; et al. | 2022-01-06 |
| Connection substrate and interposer substrate including the same Grant 11,206,736 - Ji , et al. December 21, 2 | 2021-12-21 |
| Printed circuit board assembly Grant 11,172,574 - Shin , et al. November 9, 2 | 2021-11-09 |
| Component mounted board and electronic device comprising the same Grant 11,076,485 - Kim , et al. July 27, 2 | 2021-07-27 |
| Rigid-flexible Printed Circuit Board And Electronic Component Module App 20210212201 - Hwang; Jun Oh ; et al. | 2021-07-08 |
| Package Substrate And Multi-chip Package Including The Same App 20210175176 - Ji; Yun Je ; et al. | 2021-06-10 |
| Component Mounted Board And Electronic Device Comprising The Same App 20210136916 - Kim; Tae Seong ; et al. | 2021-05-06 |
| Printed Circuit Board Assembly App 20200305282 - SHIN; Jae-Ho ; et al. | 2020-09-24 |
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