Ji; Honglei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ji; Honglei.The latest application filed is for "backlight module, light guide plate, and preparation method for conductive hydrogel of light guide plate".

Company Profile

6.5.5

Ji; Honglei - Shenzhen CN
JI; Honglei - Shenzhen City Guangdong
Ji; Honglei - Beijing CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Backlight module, light guide plate, and preparation method for conductive hydrogel of light guide plate Grant 11,300,723 - Ji , et al. April 12, 2	2022-04-12
Backlight module Grant 11,181,773 - Li , et al. November 23, 2	2021-11-23
Backlight Module, Light Guide Plate, And Preparation Method For Conductive Hydrogel Of Light Guide Plate App 20210255382 - JI; Honglei ; et al.	2021-08-19
Backlight Module App 20210240040 - LI; Zelong ; et al.	2021-08-05
Television color cast adjustment method and apparatus Grant 10,616,659 - Liu , et al.	2020-04-07
Television Color Cast Adjustment Method And Apparatus App 20190261058 - LIU; Shubiao ; et al.	2019-08-22
High accuracy measuring device for measuring large mass Grant 10,378,950 - Wang , et al. A	2019-08-13
Measuring device for measuring large mass with optical refraction and displacement measuring Grant 10,274,362 - Wang , et al.	2019-04-30
A High Accuracy Measuring Device for Measuring Large Mass App 20190086255 - WANG; Jian ; et al.	2019-03-21
A Measuring Device for Measuring Large Mass with Optical Refraction and Displacement Measuring App 20180335337 - WANG; Jian ; et al.	2018-11-22

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