loadpatents
Patent applications and USPTO patent grants for Jewram; Radesh.The latest application filed is for "thermal management of high heat flux multicomponent assembly".
Patent | Date |
---|---|
Thermal Management Of High Heat Flux Multicomponent Assembly App 20220151108 - Jewram; Radesh ;   et al. | 2022-05-12 |
Thermal Interface Materials App 20210388203 - Wu; Chunyong ;   et al. | 2021-12-16 |
Method for Packaging Thermal Interface Materials App 20130221014 - Jewram; Radesh ;   et al. | 2013-08-29 |
Method for packaging thermal interface materials Grant 8,430,264 - Jewram , et al. April 30, 2 | 2013-04-30 |
Method for packaging thermal interface materials Grant 8,205,766 - Jewram , et al. June 26, 2 | 2012-06-26 |
Thermal interface with non-tacky surface Grant 8,110,919 - Jewram , et al. February 7, 2 | 2012-02-07 |
Thermal interface with non-tacky surface Grant 8,076,773 - Jewram , et al. December 13, 2 | 2011-12-13 |
Method for Packaging Thermal Interface Materials App 20110186586 - Jewram; Radesh ;   et al. | 2011-08-04 |
Thermal Interface with Non-Tacky Surface App 20100309634 - Jewram; Radesh ;   et al. | 2010-12-09 |
Thermally and electrically conductive interconnect structures Grant 7,760,507 - Jewram , et al. July 20, 2 | 2010-07-20 |
Thermal Interface with Non-Tacky Surface App 20090166854 - Jewram; Radesh ;   et al. | 2009-07-02 |
Thermally and electrically conductive interconnect structures App 20090168354 - Jewram; Radesh ;   et al. | 2009-07-02 |
Thermal interface pad utilizing low melting metal with retention matrix Grant 6,984,685 - Misra , et al. January 10, 2 | 2006-01-10 |
Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads Grant 6,657,297 - Jewram , et al. December 2, 2 | 2003-12-02 |
Thermal interface pad utilizing low melting metal with retention matrix App 20030187116 - Misra, Sanjay ;   et al. | 2003-10-02 |
Integrated release films for phase-change interfaces Grant 6,399,209 - Misra , et al. June 4, 2 | 2002-06-04 |
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