loadpatents
name:-0.010948181152344
name:-0.0097260475158691
name:-0.00061917304992676
Jewram; Radesh Patent Filings

Jewram; Radesh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jewram; Radesh.The latest application filed is for "thermal management of high heat flux multicomponent assembly".

Company Profile
0.9.8
  • Jewram; Radesh - Lakeville MN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Thermal Management Of High Heat Flux Multicomponent Assembly
App 20220151108 - Jewram; Radesh ;   et al.
2022-05-12
Thermal Interface Materials
App 20210388203 - Wu; Chunyong ;   et al.
2021-12-16
Method for Packaging Thermal Interface Materials
App 20130221014 - Jewram; Radesh ;   et al.
2013-08-29
Method for packaging thermal interface materials
Grant 8,430,264 - Jewram , et al. April 30, 2
2013-04-30
Method for packaging thermal interface materials
Grant 8,205,766 - Jewram , et al. June 26, 2
2012-06-26
Thermal interface with non-tacky surface
Grant 8,110,919 - Jewram , et al. February 7, 2
2012-02-07
Thermal interface with non-tacky surface
Grant 8,076,773 - Jewram , et al. December 13, 2
2011-12-13
Method for Packaging Thermal Interface Materials
App 20110186586 - Jewram; Radesh ;   et al.
2011-08-04
Thermal Interface with Non-Tacky Surface
App 20100309634 - Jewram; Radesh ;   et al.
2010-12-09
Thermally and electrically conductive interconnect structures
Grant 7,760,507 - Jewram , et al. July 20, 2
2010-07-20
Thermal Interface with Non-Tacky Surface
App 20090166854 - Jewram; Radesh ;   et al.
2009-07-02
Thermally and electrically conductive interconnect structures
App 20090168354 - Jewram; Radesh ;   et al.
2009-07-02
Thermal interface pad utilizing low melting metal with retention matrix
Grant 6,984,685 - Misra , et al. January 10, 2
2006-01-10
Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads
Grant 6,657,297 - Jewram , et al. December 2, 2
2003-12-02
Thermal interface pad utilizing low melting metal with retention matrix
App 20030187116 - Misra, Sanjay ;   et al.
2003-10-02
Integrated release films for phase-change interfaces
Grant 6,399,209 - Misra , et al. June 4, 2
2002-06-04

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