JEW; Stephen

Patent Applications and Registrations

Patent applications and USPTO patent grants for JEW; Stephen.The latest application filed is for "chemical mechanical polishing with applied magnetic field".

Company Profile

4.13.26

JEW; Stephen - San Jose CA
- San Jose CA US
Jew; Stephen - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chemical Mechanical Polishing With Applied Magnetic Field App 20220193859 - WANG; Xingfeng ; et al.	2022-06-23
Slurry Distribution Device For Chemical Mechanical Polishing App 20210331288 - Yang; Yen-Chu ; et al.	2021-10-28
Slurry distribution device for chemical mechanical polishing Grant 11,077,536 - Yang , et al. August 3, 2	2021-08-03
Slurry Distribution Device For Chemical Mechanical Polishing App 20210205953 - Yang; Yen-Chu ; et al.	2021-07-08
Slurry distribution device for chemical mechanical polishing Grant 10,967,483 - Yang , et al. April 6, 2	2021-04-06
Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing Grant 10,589,397 - Duboust , et al.	2020-03-17
Slurry Distribution Device For Chemical Mechanical Polishing App 20170368663 - Yang; Yen-Chu ; et al.	2017-12-28
Slurry Distribution Device For Chemical Mechanical Polishing App 20170368664 - Yang; Yen-Chu ; et al.	2017-12-28
Endpoint Control Of Multiple Substrate Zones Of Varying Thickness In Chemical Mechanical Polishing App 20170151647 - Duboust; Alain ; et al.	2017-06-01
Temperature control of chemical mechanical polishing Grant 9,005,999 - Xu , et al. April 14, 2	2015-04-14
Endpoint Control Of Multiple Substrates Of Varying Thickness On The Same Platen In Chemical Mechanical Polishing App 20140222188 - Duboust; Alain ; et al.	2014-08-07
Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing Grant 8,694,144 - Duboust , et al. April 8, 2	2014-04-08
Control Of Polishing Of Multiple Substrates On The Same Platen In Chemical Mechanical Polishing App 20140030956 - Zhang; Jimin ; et al.	2014-01-30
Control Of Overpolishing Of Multiple Substrates On the Same Platen In Chemical Mechanical Polishing App 20140024293 - Zhang; Jimin ; et al.	2014-01-23
Temperature Control Of Chemical Mechanical Polishing App 20140004626 - XU; KUN ; et al.	2014-01-02
Control of overpolishing of multiple substrates on the same platen in chemical mechanical polishing Grant 08616935 -	2013-12-31
Control of overpolishing of multiple substrates on the same platen in chemical mechanical polishing Grant 8,616,935 - Zhang , et al. December 31, 2	2013-12-31
Use of pad conditioning in temperature controlled CMP Grant 8,292,691 - Xu , et al. October 23, 2	2012-10-23
Endpoint control of multiple-wafer chemical mechanical polishing Grant 8,295,967 - Zhang , et al. October 23, 2	2012-10-23
Endpoint Control Of Multiple Substrates Of Varying Thickness On The Same Platen In Chemical Mechanical Polishing App 20120053717 - Duboust; Alain ; et al.	2012-03-01
Tuning Of Polishing Process In Multi-carrier Head Per Platen Polishing Station App 20110300776 - Mai; David H. ; et al.	2011-12-08
Control of Overpolishing of Multiple Substrates on the Same Platen in Chemical Mechanical Polishing App 20110300775 - Zhang; Jimin ; et al.	2011-12-08
Substrate holder with liquid supporting surface Grant 8,021,211 - Chen , et al. September 20, 2	2011-09-20
Temperature Control Of Chemical Mechanical Polishing App 20100279435 - Xu; Kun ; et al.	2010-11-04
Endpoint Control Of Multiple-wafer Chemical Mechanical Polishing App 20100120330 - Zhang; Jimin ; et al.	2010-05-13
Endpoint Control Of Multiple-wafer Chemical Mechanical Polishing App 20100120331 - Carlsson; Ingemar ; et al.	2010-05-13
Use Of Pad Conditioning In Temperature Controlled Cmp App 20100081360 - Xu; Kun ; et al.	2010-04-01
Substrate Holder With Liquid Supporting Surface App 20090264056 - Chen; Hung Chih ; et al.	2009-10-22
High Throughput Low Topography Copper Cmp Process App 20090057264 - MAI; DAVID H. ; et al.	2009-03-05
Method Of Soft Pad Preparation To Reduce Removal Rate Ramp-up Effect And To Stabilize Defect Rate App 20090061743 - JEW; STEPHEN ; et al.	2009-03-05
Belt wiper for a chemical mechanical planarization system Grant 6,666,755 - Taylor , et al. December 23, 2	2003-12-23
Multi-step polishing system and process of using same App 20030060145 - Li, Youlin J. ; et al.	2003-03-27

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