Jeung; Boon Suan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jeung; Boon Suan.The latest application filed is for "method for packaging circuits".

Company Profile

3.29.40

Jeung; Boon Suan - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for packaging circuits Grant 10,811,278 - Poo , et al. October 20, 2	2020-10-20
Method For Packaging Circuits App 20190362988 - Poo; Chia Y. ; et al.	2019-11-28
Method for packaging circuits Grant 10,453,704 - Poo , et al. Oc	2019-10-22
Packaged semiconductor assemblies and methods for manufacturing such assemblies Grant 8,629,054 - Jeung , et al. January 14, 2	2014-01-14
Packaged Semiconductor Assemblies And Methods For Manufacturing Such Assemblies App 20120241982 - Jeung; Boon Suan ; et al.	2012-09-27
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20120241957 - Koon; Eng Meow ; et al.	2012-09-27
Interconnects For Packaged Semiconductor Devices And Methods For Manufacturing Such Devices App 20120211896 - Jeung; Boon Suan ; et al.	2012-08-23
Apparatus and method for packaging circuits Grant 8,138,617 - Poo , et al. March 20, 2	2012-03-20
Apparatus and method for packaging circuits Grant 8,115,306 - Poo , et al. February 14, 2	2012-02-14
Microelectronic Die Packages With Leadframes, Including Leadframe-based Interposer For Stacked Die Packages, And Associated Systems And Methods App 20110215453 - Eng; Meow Koon ; et al.	2011-09-08
Castellation wafer level packaging of integrated circuit chips Grant 8,008,126 - Jeung , et al. August 30, 2	2011-08-30
Semiconductor Assemblies And Methods Of Manufacturing Such Assemblies App 20110175206 - Kwang; Chua Swee ; et al.	2011-07-21
Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods Grant 7,947,529 - Koon , et al. May 24, 2	2011-05-24
Packaged Semiconductor Assemblies And Methods For Manufacturing Such Assemblies App 20110084402 - Jeung; Boon Suan ; et al.	2011-04-14
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20110068454 - Koon; Eng Meow ; et al.	2011-03-24
Apparatus And Method For Packaging Circuits App 20100140794 - Poo; Chia Yong ; et al.	2010-06-10
Semiconductor Assemblies And Methods Of Manufacturing Such Assemblies App 20100133662 - Kwang; Chua Swee ; et al.	2010-06-03
Castellation Wafer Level Packaging Of Integrated Circuit Chips App 20100068851 - Jeung; Boon Suan ; et al.	2010-03-18
Castellation wafer level packaging of integrated circuit chips Grant 7,679,179 - Jeung , et al. March 16, 2	2010-03-16
Apparatus and method for packaging circuits Grant 7,675,169 - Poo , et al. March 9, 2	2010-03-09
Castellation wafer level packaging of integrated circuit chips Grant 7,528,477 - Jeung , et al. May 5, 2	2009-05-05
Semiconductor Assemblies And Methods Of Manufacturing Such Assemblies App 20090057843 - Kwang; Chua Swee ; et al.	2009-03-05
Microelectronic Die Packages With Leadframes, Including Leadframe-based Interposer For Stacked Die Packages, And Associated Systems And Methods App 20090045489 - Koon; Eng Meow ; et al.	2009-02-19
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20090026600 - Koon; Eng Meow ; et al.	2009-01-29
Interconnects For Packaged Semiconductor Devices And Methods For Manufacturing Such Devices App 20090014859 - Jeung; Boon Suan ; et al.	2009-01-15
Method for fabricating packaged die Grant 7,358,154 - Poo , et al. April 15, 2	2008-04-15
Castellation Wafer Level Packaging Of Integrated Circuit Chips App 20080067675 - Jeung; Boon Suan ; et al.	2008-03-20
Apparatus And Method For Packaging Circuits App 20080054423 - Poo; Chia Y. ; et al.	2008-03-06
Support elements for semiconductor devices with peripherally located bond pads Grant 7,285,850 - Poo , et al. October 23, 2	2007-10-23
Castellation wafer level packaging of integrated circuit chips Grant 7,276,387 - Jeung , et al. October 2, 2	2007-10-02
Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods Grant 7,226,809 - Poo , et al. June 5, 2	2007-06-05
Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices Grant 7,115,984 - Poo , et al. October 3, 2	2006-10-03
Semiconductor devices including peripherally located bond pads, intermediates thereof, and assemblies and packages including the semiconductor devices App 20060208351 - Poo; Chia Yong ; et al.	2006-09-21
Support elements for semiconductor devices with peripherally located bond pads App 20060208350 - Poo; Chia Yong ; et al.	2006-09-21
Apparatus and method for packaging circuits App 20060084240 - Poo; Chia Yong ; et al.	2006-04-20
Castellation wafer level packaging of integrated circuit chips App 20060014319 - Jeung; Boon Suan ; et al.	2006-01-19
Castellation wafer level packaging of integrated circuit chips App 20060008946 - Jeung; Boon Suan ; et al.	2006-01-12
Castellation wafer level packaging of integrated circuit chips App 20060006519 - Jeung; Boon Suan ; et al.	2006-01-12
Castellation wafer level packaging of integrated circuit chips App 20060001142 - Jeung; Boon Suan ; et al.	2006-01-05
Castellation wafer level packaging of integrated circuit chips Grant 6,949,407 - Jeung , et al. September 27, 2	2005-09-27
Castellation Wafer Level Packaging Of Integrated Circuit Chips App 20050130345 - Jeung, Boon Suan ; et al.	2005-06-16
Apparatus and method for packaging circuits Grant 6,894,386 - Poo , et al. May 17, 2	2005-05-17
Castellation wafer level packaging of integrated circuit chips Grant 6,855,572 - Jeung , et al. February 15, 2	2005-02-15
Apparatus and method for packaging circuits App 20050029668 - Poo, Chia Yong ; et al.	2005-02-10
Multi-substrate microelectronic packages and methods for manufacture Grant 6,841,418 - Jeung , et al. January 11, 2	2005-01-11
Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages Grant 6,818,977 - Poo , et al. November 16, 2	2004-11-16
Multi-substrate microelectronic packages and methods for manufacture App 20040183207 - Jeung, Boon Suan ; et al.	2004-09-23
Apparatus and method for leadless packaging of semiconductor devices Grant 6,790,706 - Jeung , et al. September 14, 2	2004-09-14
Apparatus and method for leadless packaging of semiconductor devices Grant 6,787,894 - Jeung , et al. September 7, 2	2004-09-07
Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices App 20040124523 - Poo, Chia Yong ; et al.	2004-07-01
Multi-substrate microelectronic packages and methods for manufacture Grant 6,750,547 - Jeung , et al. June 15, 2	2004-06-15
Apparatus and method for leadless packaging of semiconductor devices Grant 6,747,348 - Jeung , et al. June 8, 2	2004-06-08
Apparatus and method for leadless packaging of semiconductor devices Grant 6,743,696 - Jeung , et al. June 1, 2	2004-06-01
Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods Grant 6,727,116 - Poo , et al. April 27, 2	2004-04-27
Castellation wafer level packaging of integrated circuit chips App 20040043535 - Jeung, Boon Suan ; et al.	2004-03-04
Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods App 20030232462 - Poo, Chia Yong ; et al.	2003-12-18
Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods App 20030230802 - Poo, Chia Yong ; et al.	2003-12-18
Semiconductor Devices Including Peripherally Located Bond Pads, Assemblies, Packages, And Methods App 20030232460 - Poo, Chia Yong ; et al.	2003-12-18
Wafer level stackable semiconductor package Grant 6,611,052 - Poo , et al. August 26, 2	2003-08-26
Multi-substrate microelectronic packages and methods for manufacture App 20030116861 - Jeung, Boon Suan ; et al.	2003-06-26
Stackable semiconductor package and wafer level fabrication method Grant 6,582,992 - Poo , et al. June 24, 2	2003-06-24
Stackable semiconductor package and wafer level fabrication method App 20030094683 - Poo, Chia Yong ; et al.	2003-05-22
Stackable Semiconductor Package And Wafer Level Fabrication Method App 20030096454 - Poo, Chia Yong ; et al.	2003-05-22
Apparatus and method for leadless packaging of semiconductor devices App 20030080403 - Jeung, Boon Suan ; et al.	2003-05-01
Apparatus and method for leadless packaging of semiconductor devices App 20030071341 - Jeung, Boon Suan ; et al.	2003-04-17
Apparatus and method for leadless packaging of semiconductor devices App 20030071338 - Jeung, Boon Suan ; et al.	2003-04-17
Apparatus And Method For Leadless Packaging Of Semiconductor Devices App 20030071335 - Jeung, Boon Suan ; et al.	2003-04-17
Apparatus and method for packaging circuits App 20030067001 - Poo, Chin Yong ; et al.	2003-04-10

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