Jessep; Rebecca A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jessep; Rebecca A..The latest application filed is for "via shielding for power/ground layers on printed circuit board".
- Jessep; Rebecca A. - Dallas OR
| Patent | Date |
|---|---|
| Via shielding for power/ground layers on printed circuit board Grant 7,271,349 - Jessep , et al. September 18, 2 | 2007-09-18 |
| Methods for forming via shielding Grant 7,168,164 - Jessep , et al. January 30, 2 | 2007-01-30 |
| Standoff devices and methods of using same Grant 6,941,537 - Jessep , et al. September 6, 2 | 2005-09-06 |
| Via shielding for power/ground layers on printed circuit board App 20040238216 - Jessep, Rebecca A. ; et al. | 2004-12-02 |
| Coupon registration mechanism and method Grant 6,667,090 - Boggs , et al. December 23, 2 | 2003-12-23 |
| Standoff arrangements to control distance and provide electrical function App 20030145460 - Jessep, Rebecca A. ; et al. | 2003-08-07 |
| Vented vias for via in pad technology yield improvements Grant 6,580,174 - McCormick , et al. June 17, 2 | 2003-06-17 |
| Via shielding for power/ground layers on printed circuit board App 20030091730 - Jessep, Rebecca A. ; et al. | 2003-05-15 |
| Vented Vias For Via In Pad Technology Yield Improvements App 20030064546 - McCormick, Carolyn R. ; et al. | 2003-04-03 |
| Coupon registration mechanism and method App 20030056365 - Boggs, David W. ; et al. | 2003-03-27 |
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