Jereza; Armand Vincent C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jereza; Armand Vincent C..The latest application filed is for "semiconductor die package and method for making the same".

Company Profile

1.6.5

Jereza; Armand Vincent C. - Cebu N/A PH
Jereza; Armand Vincent C. - Cebu City PH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor die package and method for making the same Grant 8,497,164 - Jereza , et al. July 30, 2	2013-07-30
Semiconductor Die Package And Method For Making The Same App 20120329214 - Jereza; Armand Vincent C. ; et al.	2012-12-27
Semiconductor die package and method for making the same Grant 8,222,718 - Jereza , et al. July 17, 2	2012-07-17
Semiconductor die package including lead with end portion Grant 8,188,587 - Jereza May 29, 2	2012-05-29
Pre-molded, clip-bonded multi-die semiconductor package Grant 7,898,067 - Jereza March 1, 2	2011-03-01
Semiconductor Die Package And Method For Making The Same App 20100193921 - Jereza; Armand Vincent C. ; et al.	2010-08-05
Pre-molded, Clip-bonded Multi-die Semiconductor Package App 20100109134 - Jereza; Armand Vincent C.	2010-05-06
Semiconductor Die Package Including Lead With End Portion App 20100109135 - Jereza; Armand Vincent C.	2010-05-06
Clipless and wireless semiconductor die package and method for making the same Grant 7,371,616 - Jereza May 13, 2	2008-05-13
Clipless and wireless semiconductor die package and method for making the same App 20070155058 - Jereza; Armand Vincent C.	2007-07-05

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