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Patent applications and USPTO patent grants for Jereza; Armand Vincent.The latest application filed is for "thin semiconductor device packages and methods of manufacture".
Patent | Date |
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Thin semiconductor device packages Grant 9,685,398 - Rios , et al. June 20, 2 | 2017-06-20 |
Thin Semiconductor Device Packages And Methods Of Manufacture App 20160284628 - RIOS; Margie ;   et al. | 2016-09-29 |
Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same Grant 7,816,784 - Son , et al. October 19, 2 | 2010-10-19 |
Power Quad Flat No-lead Semiconductor Die Packages With Isolated Heat Sink For High-voltage, High-power Applications, Systems Using The Same, And Methods Of Making The Same App 20100148328 - Son; Joon-Seo ;   et al. | 2010-06-17 |
Semiconductor Die Packages Having Solder-free Connections, Systems Using the Same, and Methods of Making the Same App 20090179315 - Jereza; Armand Vincent | 2009-07-16 |
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