Jeong; Teahwa
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jeong; Teahwa.The latest application filed is for "semiconductor package".
- Jeong; Teahwa - Hwaseong-si KR
| Patent | Date |
|---|---|
| Semiconductor packages including an insulating layer including a recessed surface and methods of manufacturing the same Grant 11,444,014 - Chun , et al. September 13, 2 | 2022-09-13 |
| Semiconductor Package App 20220077043 - KANG; GYUHO ; et al. | 2022-03-10 |
| Interconnection Structure And Semiconductor Package Including The Same App 20210343634 - CHOI; Ju-Il ; et al. | 2021-11-04 |
| Semiconductor Packages And Methods Of Manufacturing The Same App 20210090984 - CHUN; JINHO ; et al. | 2021-03-25 |
| Semiconductor devices and methods of manufacturing the same Grant 10,872,869 - Jin , et al. December 22, 2 | 2020-12-22 |
| Semiconductor Devices And Methods Of Manufacturing The Same App 20200058609 - JIN; Jeonggi ; et al. | 2020-02-20 |
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