Jeong; Sung Won

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jeong; Sung Won.The latest application filed is for "fan-out semiconductor package and electronic device including the same".

Company Profile

7.36.51

Jeong; Sung Won - Suwon-si KR
Jeong; Sung-Won - Changwon-si KR
Jeong; Sung-Won - Gyeonggi-do KR
Jeong; Sung Won - Yongin KR
Jeong; Sung Won - Gyeongsangnam-do KR
Jeong; Sung Won - Gyunggi-do N/A KR
Jeong; Sung Won - Suwon KR
Jeong; Sung Won - Chungcheongnam-do KR
Jeong; Sung Won - Yongin-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fan-out semiconductor package Grant 11,121,066 - Kim , et al. September 14, 2	2021-09-14
Fan-out Semiconductor Package And Electronic Device Including The Same App 20210118791 - Kim; Sun Ho ; et al.	2021-04-22
Fan-out semiconductor package and electronic device including the same Grant 10,861,784 - Kim , et al. December 8, 2	2020-12-08
Fan-out Semiconductor Package And Electronic Device Including The Same App 20200294904 - KIM; Sun Ho ; et al.	2020-09-17
Fan-out semiconductor package and electronic device including the same Grant 10,679,933 - Kim , et al.	2020-06-09
Fan-out Semiconductor Package App 20200091054 - Kim; Da Hee ; et al.	2020-03-19
Fan-out Semiconductor Package And Electronic Device Including The Same App 20200043842 - KIM; Sun Ho ; et al.	2020-02-06
Memory device and memory system performing an unmapped read Grant 10,545,880 - Heo , et al. Ja	2020-01-28
Fan-out semiconductor package Grant 10,522,451 - Kim , et al. Dec	2019-12-31
Data storage device and method of operating the same Grant 10,490,237 - Yoon , et al. Nov	2019-11-26
Electronic component package having stress alleviation structure Grant 10,461,008 - Jeong , et al. Oc	2019-10-29
Fan-out semiconductor package and electronic device including the same Grant 10,446,481 - Kim , et al. Oc	2019-10-15
Nonvolatile memory device and method of throttling temperature of nonvolatile memory device Grant 10,445,010 - Jeong , et al. Oc	2019-10-15
Fan-out semiconductor package Grant 10,332,855 - Lee , et al.	2019-06-25
Fan-out semiconductor package Grant 10,304,807 - Park , et al.	2019-05-28
Data Storage Device And Method Of Operating The Same App 20190130947 - YOON; JONG HYUN ; et al.	2019-05-02
Fan-out semiconductor package Grant 10,211,136 - Kim , et al. Feb	2019-02-19
Fan-out semiconductor package Grant 10,157,886 - Park , et al. Dec	2018-12-18
Fan-out Semiconductor Package And Electronic Device Including The Same App 20180342452 - KIM; Sun Ho ; et al.	2018-11-29
Fan-out Semiconductor Package App 20180342449 - KIM; Da Hee ; et al.	2018-11-29
Fan-out semiconductor package and electronic device including the same Grant 10,128,179 - Kim , et al. November 13, 2	2018-11-13
Fan-out semiconductor package and electronic device including the same Grant 10,115,648 - Seo , et al. October 30, 2	2018-10-30
Electronic component package and package-on-package structure including the same Grant 10,109,588 - Jeong , et al. October 23, 2	2018-10-23
Fan-out Semiconductor Package App 20180233489 - PARK; Dae Hyun ; et al.	2018-08-16
Electronic component package and method of manufacturing the same Grant 10,002,811 - Ko , et al. June 19, 2	2018-06-19
Memory Device And Memory System Performing An Unmapped Read App 20180137058 - HEO; YOUNG-HOI ; et al.	2018-05-17
Fan-out Semiconductor Package App 20180096927 - KIM; Da Hee ; et al.	2018-04-05
Electronic component package and electronic device including the same Grant 9,929,117 - Lee , et al. March 27, 2	2018-03-27
Fan-out Semiconductor Package App 20180076178 - PARK; Dae Hyun ; et al.	2018-03-15
Nonvolatile Memory Device And Method Of Throttling Temperature Of Nonvolatile Memory Device App 20180067678 - JEONG; Sung-Won ; et al.	2018-03-08
Electronic component package and electronic device including the same Grant 9,859,243 - Lee , et al. January 2, 2	2018-01-02
Fan-out Semiconductor Package App 20170365572 - LEE; Doo Hwan ; et al.	2017-12-21
Electronic Component Package And Electronic Device Including The Same App 20170358548 - LEE; Ji Hyun ; et al.	2017-12-14
Data processing system and method of operating the same Grant 9,836,220 - Jeong , et al. December 5, 2	2017-12-05
Electronic Component Package And Method Of Manufacturing The Same App 20170309531 - KO; Young Gwan ; et al.	2017-10-26
Electronic component package and method of manufacturing the same Grant 9,741,630 - Ko , et al. August 22, 2	2017-08-22
Printed circuit board, electronic module and method of manufacturing the same Grant 9,706,668 - Kim , et al. July 11, 2	2017-07-11
Electronic Component Package And Method Of Manufacturing The Same App 20170178984 - KO; Young Gwan ; et al.	2017-06-22
Electronic Component Package App 20170178992 - JEONG; Sung Won ; et al.	2017-06-22
Fan-out Semiconductor Package And Electronic Device Including The Same App 20170148699 - SEO; Shang Hoon ; et al.	2017-05-25
Electronic Component Package And Electronic Device Including The Same App 20170141063 - LEE; Ji Hyun ; et al.	2017-05-18
Fan-out Semiconductor Package And Electronic Device Including The Same App 20170133309 - KIM; Sun Ho ; et al.	2017-05-11
Electronic Component Package And Package-on-package Structure Including The Same App 20160336296 - JEONG; Sung Won ; et al.	2016-11-17
Printed Circuit Board, Electronic Module And Method Of Manufacturing The Same App 20160120060 - KIM; Da-Hee ; et al.	2016-04-28
Data Processing System And Method Of Operating The Same App 20160110103 - JEONG; SUNG-WON ; et al.	2016-04-21
File system and file storing method Grant 9,292,524 - Jeong , et al. March 22, 2	2016-03-22
Detach Core Substrate And Method For Manufacturing Thereof App 20160081195 - CHO; Yong Yoon ; et al.	2016-03-17
Printed Circuit Board And Method Of Manufacturing The Same App 20160021736 - HAN; Gi Ho ; et al.	2016-01-21
Lead pin for package substrate Grant 9,142,499 - Lee , et al. September 22, 2	2015-09-22
Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20150129291 - JEONG; Sung Won ; et al.	2015-05-14
Printed Circuit Board And Method For Manufacturing The Same App 20150101857 - KIM; Da Hee ; et al.	2015-04-16
Interposer And Semiconductor Package Using The Same, And Method Of Manufacturing Interposer App 20150061093 - KIM; Ki Hwan ; et al.	2015-03-05
Lead Pin For Package Substrate App 20140291851 - LEE; Ki Taek ; et al.	2014-10-02
Package substrate and fabricating method thereof Grant 8,822,841 - Lee , et al. September 2, 2	2014-09-02
Fuel cell stack Grant 8,790,843 - Na , et al. July 29, 2	2014-07-29
Lead pin for package substrate Grant 8,766,450 - Lee , et al. July 1, 2	2014-07-01
Insulating Layer Conduction Method App 20140144575 - JEONG; Sung Won	2014-05-29
Multi-layer Type Printed Circuit Board And Method Of Manufacturing The Same App 20140102767 - Kang; Myung Sam ; et al.	2014-04-17
Mobile Terminals And Methods Of Operating The Same App 20140101583 - JEONG; Sung-won ; et al.	2014-04-10
Method For Manufacturing Razor Blade Edge And Razor Blade For Razor App 20130334033 - Jeong; Sung Won	2013-12-19
Memory card socket and data processing device including the same Grant 8,608,072 - Jeong , et al. December 17, 2	2013-12-17
Printed Circuit Board And Method For Manufacturing The Same App 20130168144 - Jeong; Sung Won ; et al.	2013-07-04
File System And File Storing Method App 20130166611 - JEONG; Sung-Won ; et al.	2013-06-27
Package Substrate And Fabricating Method Thereof App 20120267285 - LEE; Dong Gyu ; et al.	2012-10-25
Memory Card Socket And Data Processing Device Including The Same App 20120234917 - JEONG; Sung Won ; et al.	2012-09-20
Stack for fuel cell Grant 8,232,021 - Suh , et al. July 31, 2	2012-07-31
Printed Circuit Board And Method For Manufacturing The Same App 20120118621 - CHOI; Jin Won ; et al.	2012-05-17
Lead pin for package substrate Grant 8,142,240 - Oh , et al. March 27, 2	2012-03-27
Method of manufacturing printed circuit board App 20110079349 - Cho; Suk Hyeon ; et al.	2011-04-07
Package substrate App 20110076472 - Kim; Jin Ho ; et al.	2011-03-31
Package Substrate App 20110067901 - KIM; Jin Ho ; et al.	2011-03-24
Lead pin for package substrate App 20110068473 - Lee; Ki Taek ; et al.	2011-03-24
Fuel cell system and method for controlling operation of the fuel cell system Grant 7,884,567 - Kim , et al. February 8, 2	2011-02-08
Lead pin for package substrate App 20110014826 - Lee; Ki Taek ; et al.	2011-01-20
Lead pin for package substrate App 20110014827 - Oh; Heung Jae ; et al.	2011-01-20
Apparatus And Method For Automatic Testing Of Software Or Digital Devices App 20100095159 - JEONG; Sung-won ; et al.	2010-04-15
Fuel cell stack App 20090092873 - Jeong; Sung-Won ; et al.	2009-04-09
Stack For Fuel Cell App 20080299443 - Suh; Jun-Won ; et al.	2008-12-04
Fuel Cell Stack App 20080268315 - NA; YOUNG-SEUNG ; et al.	2008-10-30
Fuel Cell System And Method For Controlling Operation Of The Fuel Cell System App 20080116843 - Kim; Dong-rak ; et al.	2008-05-22