Jeong; Koo Woong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jeong; Koo Woong.The latest application filed is for "package-embedded board".
- Jeong; Koo Woong - Suwon-si KR
- Jeong; Koo Woong - Gongju Si N/A KR
- Jeong; Koo-Woong - Choongchungnam-do KR
- Jeong; Koo-Woong - Seoul KR
| Patent | Date |
|---|---|
| Electronic component-embedded substrate Grant 11,439,021 - Jeong , et al. September 6, 2 | 2022-09-06 |
| Package-embedded Board App 20220208629 - JEONG; Koo Woong | 2022-06-30 |
| Printed Circuit Board App 20220199506 - Jeong; Koo Woong | 2022-06-23 |
| Electronic Component-embedded Substrate App 20220007511 - Jeong; Koo Woong ; et al. | 2022-01-06 |
| Semiconductor device with micro electromechanical system die Grant 8,921,955 - Lee , et al. December 30, 2 | 2014-12-30 |
| Method for Forming Multi-Layered Binary Oxide Film for Use in Resistance Random Access Memory App 20080200003 - Hong; Jin-Pyo ; et al. | 2008-08-21 |
| Memory Device And Method For Fabricating The Same App 20080185687 - Hong; Jin-Pyo ; et al. | 2008-08-07 |
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