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Patent applications and USPTO patent grants for JEONG; Jang Hwan.The latest application filed is for "resin composition and manufacturing method of coating layer using the same".
Patent | Date |
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Resin Composition And Manufacturing Method Of Coating Layer Using The Same App 20220195237 - KIM; Sung ;   et al. | 2022-06-23 |
Photomask, Exposure Apparatus, And Method Of Fabricating Three-dimensional Semiconductor Memory Device Using The Same App 20220128900 - KIM; Donghwan ;   et al. | 2022-04-28 |
Acrylic adhesive and protective film including the same Grant 10,975,274 - Kim , et al. April 13, 2 | 2021-04-13 |
Resin Composition And Manufacturing Method Of Coating Layer Using The Same App 20180320020 - KIM; Sung ;   et al. | 2018-11-08 |
Acrylic Adhesive And Protective Film Including The Same App 20180022973 - KIM; Sung ;   et al. | 2018-01-25 |
Method of forming semiconductor device patterns Grant 8,227,354 - Kim , et al. July 24, 2 | 2012-07-24 |
Method Of Forming Semiconductor Device Patterns App 20100173492 - Kim; Bong-cheol ;   et al. | 2010-07-08 |
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