Jeong; In-kwon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jeong; In-kwon.The latest application filed is for "vertical structure leds".

Company Profile

4.45.52

Jeong; In-kwon - Cupertino CA
Jeong; In-Kwon - Seongnam KR
Jeong; In Kwon - Sunnyvale CA
Jeong; In-Kwon - US
Jeong; In-Kwon - Kyunggi-do KR
Jeong; In-kwon - Kyungki-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Vertical structure LEDs Grant 10,600,933 - Lee , et al.	2020-03-24
Vertical structure LEDs Grant 10,461,217 - Lee , et al. Oc	2019-10-29
Vertical structure LEDs Grant 10,453,993 - Lee , et al. Oc	2019-10-22
Vertical structure LEDs Grant 10,243,101 - Lee , et al.	2019-03-26
Vertical structure LEDs Grant 9,882,084 - Lee , et al. January 30, 2	2018-01-30
Vertical structure LEDs Grant 9,472,727 - Lee , et al. October 18, 2	2016-10-18
Vertical Structure Leds App 20160079482 - LEE; Jong Lam ; et al.	2016-03-17
Vertical structure LEDs Grant 9,224,907 - Lee , et al. December 29, 2	2015-12-29
Atomic Layer Deposition Apparatus App 20150184295 - Jeong; In Kwon	2015-07-02
Apparatus And Method Of Atomic Layer Deposition App 20150096495 - Jeong; In Kwon	2015-04-09
Vertical Structure Leds App 20150048307 - LEE; Jong Lam ; et al.	2015-02-19
Vertical structure LEDs Grant 8,896,017 - Lee , et al. November 25, 2	2014-11-25
Method of fabricating vertical structure LEDs Grant 8,384,120 - Lee , et al. February 26, 2	2013-02-26
Method Of Fabricating Vertical Structure Leds App 20110193128 - Lee; Jong Lam ; et al.	2011-08-11
Apparatuses And Methods For Polishing And Cleaning Semiconductor Wafers App 20110104997 - Jeong; In-Kwon	2011-05-05
Method of fabricating vertical structure LEDs Grant 7,928,465 - Lee , et al. April 19, 2	2011-04-19
Method Of Fabricating Vertical Structure Leds App 20100308368 - Lee; Jong-Lam ; et al.	2010-12-09
Method of fabricating vertical structure LEDs Grant 7,816,705 - Lee , et al. October 19, 2	2010-10-19
Methods of forming electrical interconnects on integrated circuit substrates using selective slurries Grant RE41,842 - Jeong October 19, 2	2010-10-19
Configurable polishing apparatus Grant 7,775,853 - Jeong , et al. August 17, 2	2010-08-17
Apparatus and method for polishing objects using object cleaners Grant 7,674,154 - Jeong March 9, 2	2010-03-09
Apparatus And Method For Polishing Semiconductor Wafers Using One Or More Polishing Surfaces App 20100009599 - Jeong; In Kwon	2010-01-14
Method of fabricating vertical structure LEDs App 20090278161 - Lee; Jong-Lam ; et al.	2009-11-12
Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces Grant 7,591,711 - Jeong September 22, 2	2009-09-22
Method of fabricating vertical structure LEDs Grant 7,588,952 - Lee , et al. September 15, 2	2009-09-15
Method of fabricating vertical structure LEDs Grant 7,576,368 - Lee , et al. August 18, 2	2009-08-18
Method of fabricating vertical structure LEDs Grant 7,569,865 - Lee , et al. August 4, 2	2009-08-04
Method of fabricating vertical structure LEDs Grant 7,563,629 - Lee , et al. July 21, 2	2009-07-21
Polishing Apparatus And Method For Polishing Semiconductor Wafers Using Load-unload Stations App 20090061739 - Jeong; In-Kwon	2009-03-05
Method of fabricating vertical structure LEDs Grant 7,462,881 - Lee , et al. December 9, 2	2008-12-09
Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups Grant 7,374,471 - Jeong May 20, 2	2008-05-20
Apparatus and method for polishing semiconductor wafers using pivotable load/unload cups Grant 7,367,866 - Jeong May 6, 2	2008-05-06
Polishing head for polishing semiconductor wafers Grant 7,364,496 - Berkstresser , et al. April 29, 2	2008-04-29
Configurable Polishing Apparatus App 20080051014 - Jeong; In-Kwon ; et al.	2008-02-28
Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers App 20080038992 - Jeong; In Kwon	2008-02-14
Apparatus And Method For Polishing Semiconductor Wafers App 20080038993 - Jeong; In-Kwon	2008-02-14
Polishing Head For Polishing Semiconductor Wafers App 20080014842 - Berkstresser; David E. ; et al.	2008-01-17
Method of fabricating vertical structure leds App 20080001166 - Lee; Jong-Lam ; et al.	2008-01-03
Method of fabricating vertical structure LEDs App 20070295986 - Lee; Jong-Lam ; et al.	2007-12-27
System and method for wet cleaning a semiconductor wafer Grant 7,306,002 - Kim , et al. December 11, 2	2007-12-11
Polishing Head For Polishing Semiconductor Wafers App 20070207709 - Berkstresser; David E. ; et al.	2007-09-06
Methods For Fabricating One Or More Metal Damascene Structures In A Semiconductor Wafer App 20070202698 - Jeong; In Kwon	2007-08-30
Apparatus and method for treating surfaces of semiconductor wafers using ozone Grant 7,258,124 - Jeong , et al. August 21, 2	2007-08-21
Apparatus And Method For Polishing Semiconductor Wafers Using One Or More Polishing Surfaces App 20070190903 - Jeong; In Kwon	2007-08-16
Method of fabricating vertical structure LEDs Grant 7,250,638 - Lee , et al. July 31, 2	2007-07-31
Methods for fabricating one or more metal damascene structures in a semiconductor wafer Grant 7,238,614 - Jeong July 3, 2	2007-07-03
Multi-channel temperature control system for semiconductor processing facilities Grant 7,225,864 - Jeong June 5, 2	2007-06-05
Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces Grant 7,223,153 - Jeong May 29, 2	2007-05-29
Apparatus and method for polishing objects using object cleaners App 20070060023 - Jeong; In Kwon	2007-03-15
Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers Grant 7,186,165 - Jeong March 6, 2	2007-03-06
Chemical mechanical polishing tool, apparatus and method App 20060281393 - Jeong; In Kwon	2006-12-14
Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers App 20060264156 - Jeong; In Kwon	2006-11-23
Method of fabricating vertical structure LEDs App 20060244001 - Lee; Jong-Lam ; et al.	2006-11-02
Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers Grant 7,104,867 - Jeong September 12, 2	2006-09-12
Multi-channel temperature control system for semiconductor processing facilities Grant 7,069,984 - Jeong July 4, 2	2006-07-04
Apparatus and method for treating surfaces of semiconductor wafers using ozone App 20060112980 - Jeong; In Kwon ; et al.	2006-06-01
Apparatus and method for cleaning surfaces of semiconductor wafers using ozone Grant 7,051,743 - Kim , et al. May 30, 2	2006-05-30
Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers App 20060105680 - Jeong; In Kwon	2006-05-18
Method of fabricating vertical structure LEDs App 20060099730 - Lee; Jong-Lam ; et al.	2006-05-11
Methods for fabricating one or more metal damascene structures in a semiconductor wafer App 20060099807 - Jeong; In Kwon	2006-05-11
Method of fabricating vertical structure LEDs App 20060071230 - Lee; Jong-Lam ; et al.	2006-04-06
Apparatus and method for treating surfaces of semiconductor wafers using ozone Grant 7,022,193 - Jeong , et al. April 4, 2	2006-04-04
Apparatus and method for polishing semiconductor wafers using pivotable load/unload cups App 20060046617 - Jeong; In Kwon	2006-03-02
Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers Grant 7,004,815 - Jeong February 28, 2	2006-02-28
CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines App 20050282472 - Jeong, In Kwon	2005-12-22
System and method for processing semiconductor wafers using different wafer processes App 20050252779 - Jeong, In Kwon	2005-11-17
Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers App 20050227586 - Jeong, In Kwon	2005-10-13
CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines Grant 6,949,466 - Jeong September 27, 2	2005-09-27
System and method for processing semiconductor wafers using different wafer processes Grant 6,949,177 - Jeong September 27, 2	2005-09-27
Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers Grant 6,942,545 - Jeong September 13, 2	2005-09-13
Chemical mechanical polishing tool, apparatus and method Grant 6,905,398 - Jeong June 14, 2	2005-06-14
Method of fabricating vertical structure LEDs App 20050098792 - Lee, Jong-Lam ; et al.	2005-05-12
Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers App 20050070210 - Jeong, In Kwon	2005-03-31
Apparatus and method for treating surfaces of semiconductor wafers using ozone App 20050056306 - Jeong, In Kwon ; et al.	2005-03-17
Rigid plate assembly with polishing pad and method of using Grant 6,835,118 - Berkstresser , et al. December 28, 2	2004-12-28
Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups App 20040216842 - Jeong, In Kwon	2004-11-04
Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces App 20040209550 - Jeong, In Kwon	2004-10-21
Multi-channel temperature control system for semiconductor processing facilities App 20040182563 - Jeong, In Kwon	2004-09-23
System and method for wet cleaning a semiconductor wafer App 20040132318 - Kim, Yong Bae ; et al.	2004-07-08
Apparatus and method for treating surfaces of semiconductor wafers using ozone App 20040079396 - Jeong, In Kwon ; et al.	2004-04-29
Apparatus and method for cleaning surfaces of semiconductor wafers using ozone App 20040079395 - Kim, Yong Bae ; et al.	2004-04-29
Nozzle assembly, system and method for wet processing a semiconductor wafer App 20040062874 - Kim, Yong Bae ; et al.	2004-04-01
System and method for processing semiconductor wafers using different wafer processes App 20030217811 - Jeong, In Kwon	2003-11-27
Method of fabricating vertical structure leds App 20030189215 - Lee, Jong-Lam ; et al.	2003-10-09
Chemical-mechanical-polishing station Grant 6,586,336 - Jeong July 1, 2	2003-07-01
Rigid plate assembly with polishing pad and method of using App 20030114079 - Berkstresser, David ; et al.	2003-06-19
CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines App 20030054648 - Jeong, In Kwon	2003-03-20
Chemical mechanical polishing tool, apparatus and method App 20030049997 - Jeong, In Kwon	2003-03-13
Chemical-mechanical-polishing station App 20030045107 - Jeong, In Kwon	2003-03-06
CMP system and method for efficiently processing semiconductor wafers App 20030022498 - Jeong, In Kwon	2003-01-30
Apparatus and method for polishing multiple semiconductor wafers in parallel App 20030003852 - Jeong, In Kwon	2003-01-02
Method of forming a capacitor lower electrode using a CMP stopping layer Grant 6,465,351 - Jeong October 15, 2	2002-10-15
System and method for chemical mechanical polishing using multiple small polishing pads App 20020132566 - Jeong, In Kwon	2002-09-19
Multi-channel temperature control system for semiconductor processing facilities App 20020104646 - Jeong, In Kwon	2002-08-08
Chemical mechanical polishing systems including brushes and related methods Grant 5,961,377 - Jeong October 5, 1	1999-10-05
Methods of forming electrical interconnects on integrated circuit substrates using selective slurries Grant 5,960,317 - Jeong September 28, 1	1999-09-28

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