Jeong; Hyeck-Jin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jeong; Hyeck-Jin.The latest application filed is for "semiconductor package transferring apparatus and method of manufacturing semiconductor device using the same".

Company Profile

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Jeong; Hyeck-Jin - Cheonan-si N/A KR
Jeong; Hyeck-Jin - Chungcheongnam-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package transferring apparatus and method of manufacturing semiconductor device using the same Grant 8,937,483 - Jeong , et al. January 20, 2	2015-01-20
Semiconductor Package Transferring Apparatus And Method Of Manufacturing Semiconductor Device Using The Same App 20120043253 - Jeong; Hyeck-Jin ; et al.	2012-02-23
Semiconductor device and method of manufacturing the same App 20090174078 - Jeong; Hyeck-Jin ; et al.	2009-07-09
Apparatus and method for testing semiconductor chip Grant 7,420,382 - Ko , et al. September 2, 2	2008-09-02
Insert with support for semiconductor package App 20070182432 - Jeong; Hyeck-Jin ; et al.	2007-08-09
POGO pin and test socket including the same Grant 7,245,138 - Jeong , et al. July 17, 2	2007-07-17
Insert having independently movable latch mechanism for semiconductor package Grant 7,235,991 - Kim , et al. June 26, 2	2007-06-26
Self-cleaning socket pin App 20070141877 - Lee; Se-Un ; et al.	2007-06-21
Insert having independently movable latch mechanism for semiconductor package App 20070075702 - Kim; Jin-Woog ; et al.	2007-04-05
Apparatus, customer tray, and method for testing semiconductor packages App 20070013404 - Yoon; Seok-young ; et al.	2007-01-18
POGO pin and test socket including the same App 20060145719 - Jeong; Hyeck-Jin ; et al.	2006-07-06
Apparatus and method for testing semiconductor chip App 20060119375 - Ko; Jun-Young ; et al.	2006-06-08

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