JEONG; Hun

Patent Applications and Registrations

Patent applications and USPTO patent grants for JEONG; Hun.The latest application filed is for "method of preparing nanocomposite material plated with network-type metal layer through silica self-cracks and wearable electronics carbon fiber prepared therefrom".

Company Profile

1.8.13

JEONG; Hun - Jeonju-si KR
Jeong; Hun - Daejeon KR
Jeong; Hun - Kyunggi-Do KR
Jeong; Hun - Yongin-Si KR
Jeong; Hun - Seoul KR
Jeong; Hun - Yongin KR
Jeong; Hun - Gyeonggi-Do KR
Jeong; Hun - Yongin-City KR
Jeong; Hun - Kumi-shi KR
Jeong; Hun - Kyongsangbuk-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Preparing Nanocomposite Material Plated With Network-type Metal Layer Through Silica Self-cracks And Wearable Electronics Carbon Fiber Prepared Therefrom App 20210246558 - KIM; Hong-gun ; et al.	2021-08-12
Foam Composition and Foam Tape Including Foam Layer Including Cured Product Thereof App 20200385542 - Seo; Beom Doo ; et al.	2020-12-10
Heat Dissipating Sheet App 20160076829 - Lee; Mihee ; et al.	2016-03-17
Thermal Interface Compositions And Methods For Making And Using Same App 20150303129 - Ouderkirk; Andrew J. ; et al.	2015-10-22
Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die Grant 8,932,908 - Lee , et al. January 13, 2	2015-01-13
Multi-component films for optical display filters Grant 8,630,040 - Bright , et al. January 14, 2	2014-01-14
Semiconductor Device and Method of Forming Partially-Etched Conductive Layer Recessed Within Substrate for Bonding to Semiconductor Die App 20130249090 - Lee; KyuWon ; et al.	2013-09-26
Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die Grant 8,502,392 - Lee , et al. August 6, 2	2013-08-06
Semiconductor Device and Method of Forming Partially-Etched Conductive Layer Recessed Within Substrate for Bonding to Semiconductor Die App 20120326303 - Lee; KyuWon ; et al.	2012-12-27
Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die Grant 8,288,202 - Lee , et al. October 16, 2	2012-10-16
Semiconductor Device and Method of Forming Partially-Etched Conductive Layer Recessed Within Substrate for Bonding to Semiconductor Die App 20120126416 - Lee; KyuWon ; et al.	2012-05-24
Composition, Tape, And Use Thereof App 20110132537 - Choi; Jeongwan ; et al.	2011-06-09
Electromagnetic Wave Shielding Gasket Having Elasticity And Adhesiveness App 20090291608 - Choi; Jeongwan ; et al.	2009-11-26
Multi-component Films For Optical Display Filters App 20090109537 - BRIGHT; Clark I. ; et al.	2009-04-30
Liquid crystal display device and method of fabricating the same Grant 6,917,407 - Jeong , et al. July 12, 2	2005-07-12
Exposure mask for liquid crystal display device and exposure method thereof Grant 6,743,555 - Jeong , et al. June 1, 2	2004-06-01
Exposure mask for liquid crystal display device and exposure method thereof App 20030123014 - Jeong, Hun ; et al.	2003-07-03
Liquid crystal display device and method of fabricating the same App 20030123006 - Jeong, Hun ; et al.	2003-07-03

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