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Jeong; Do-Soo Patent Filings

Jeong; Do-Soo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jeong; Do-Soo.The latest application filed is for "package stacked semiconductor device having pin linking means".

Company Profile
0.8.2
  • Jeong; Do-Soo - Suwon KR
  • Jeong, Do-Soo - Suwon-city KR
  • Jeong, Do Soo - Kyungki-do KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Package stacked semiconductor device having pin linking means
Grant 6,707,142 - Jeong , et al. March 16, 2
2004-03-16
Package Stacked Semiconductor Device Having Pin Linking Means
App 20030201529 - Jeong, Do-Soo ;   et al.
2003-10-30
Method for manufacturing a chip scale package
App 20020048951 - Jeong, Do Soo ;   et al.
2002-04-25
Semiconductor device package having twice-bent tie bar and small die pad
Grant 6,229,205 - Jeong , et al. May 8, 2
2001-05-08
Multi-chip package
Grant 6,087,722 - Lee , et al. July 11, 2
2000-07-11
Wire bond packages for semiconductor chips and related methods and assemblies
Grant 6,013,946 - Lee , et al. January 11, 2
2000-01-11
Chip-size package (CSP) using a multi-layer laminated lead frame
Grant 5,894,107 - Lee , et al. April 13, 1
1999-04-13
Lead frames including extended tie-bars, and semiconductor chip packages using same
Grant 5,811,875 - Jeong , et al. September 22, 1
1998-09-22
Stacked chip package device employing a plurality of lead on chip type semiconductor chips
Grant 5,804,874 - An , et al. September 8, 1
1998-09-08
Three dimensional stack package device having exposed coupling lead portions and vertical interconnection elements
Grant 5,744,827 - Jeong , et al. April 28, 1
1998-04-28

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