Jeon; Young Doo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jeon; Young Doo.The latest application filed is for "semiconductor packaging substrate fine pitch metal bump and reinforcement structures".
- Jeon; Young Doo - San Jose CA
- JEON; Young-Doo - Hwaseong-si KR
- Jeon; Young-Doo - Bucheon-si KR
- Jeon; Young-Doo - Seoul KR
- Jeon; Young Doo - Taejon KR
| Patent | Date |
|---|---|
| Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinforcement Structures App 20200381383 - Hsu; Jun Chung ; et al. | 2020-12-03 |
| Semiconductor Devices App 20200119181 - JEON; Young-Doo ; et al. | 2020-04-16 |
| Integrated circuit die decoupling system with reduced inductance Grant 9,548,288 - Ramachandran , et al. January 17, 2 | 2017-01-17 |
| Method For Fabricating Semiconductor Device App 20090130601 - Jeon; Young-Doo | 2009-05-21 |
| Mask For Forming Contact Hole App 20080035980 - Jeon; Young-Doo | 2008-02-14 |
| Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method Grant 6,362,090 - Paik , et al. March 26, 2 | 2002-03-26 |
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