Jeon; Myoung-soo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jeon; Myoung-soo.The latest application filed is for "decoupling capacitor for an integrated circuit and method of manufacturing thereof".

Company Profile

0.12.14

Jeon; Myoung-soo - Fremont CA
Jeon, Myoung-Soo - US
Jeon; Myoung Soo - Anyang KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Die package for connection to a substrate Grant 7,253,365 - Crane, Jr. , et al. August 7, 2	2007-08-07
Decoupling capacitor for an integrated circuit and method of manufacturing thereof App 20060279904 - Crane; Stanford W. JR. ; et al.	2006-12-14
Hermetic seal Grant 7,135,768 - Crane, Jr. , et al. November 14, 2	2006-11-14
Decoupling capacitor for an integrated circuit and method of manufacturing thereof Grant 7,123,465 - Crane, Jr. , et al. October 17, 2	2006-10-17
High performance optoelectronic packaging assembly Grant 7,070,340 - Crane, Jr. , et al. July 4, 2	2006-07-04
Modular coaxial electrical interconnect system and method of making the same App 20060105636 - Crane; Stanford W. JR. ; et al.	2006-05-18
Decoupling capacitor for an integrated circuit and method of manufacturing thereof App 20060067031 - Crane; Stanford W. JR. ; et al.	2006-03-30
Modular coaxial electrical interconnect system having a modular frame and electrically shielded signal paths and a method of making the same Grant 6,905,367 - Crane, Jr. , et al. June 14, 2	2005-06-14
Packaged semiconductor device for radio frequency shielding Grant 6,847,115 - Crane, Jr. , et al. January 25, 2	2005-01-25
Die package for connection to a substrate App 20040232447 - Crane, Stanford W. JR. ; et al.	2004-11-25
Semiconductor die package having mesh power and ground planes App 20040222514 - Crane, Stanford W. JR. ; et al.	2004-11-11
Semiconductor die package having mesh power and ground planes Grant 6,803,650 - Crane, Jr. , et al. October 12, 2	2004-10-12
Die package for connection to a substrate Grant 6,797,882 - Crane, Jr. , et al. September 28, 2	2004-09-28
Micro grid array semiconductor die package Grant 6,734,546 - Crane, Jr. , et al. May 11, 2	2004-05-11
Modular semiconductor die package and method of manufacturing thereof Grant 6,700,138 - Crane, Jr. , et al. March 2, 2	2004-03-02
Modular semiconductor die package and method of manufacturing thereof App 20040026757 - Crane, Stanford W. JR. ; et al.	2004-02-12
Modular coaxial electrical interconnect system and method of making the same App 20040014360 - Crane, Stanford W. JR. ; et al.	2004-01-22
Micro grid array semiconductor die package App 20030162319 - Crane, Stanford W. JR. ; et al.	2003-08-28
Modular semiconductor die package and method of manufacturing thereof App 20030160314 - Crane, Stanford W. JR. ; et al.	2003-08-28
Semiconductor package Grant 6,603,193 - Crane, Jr. , et al. August 5, 2	2003-08-05
Semiconductor package App 20030042582 - Crane, Stanford W. JR. ; et al.	2003-03-06
Hermetic seal App 20030042598 - Crane, Stanford W. JR. ; et al.	2003-03-06
Semiconductor package App 20030042596 - Crane, Stanford W. JR. ; et al.	2003-03-06
High performance optoelectronic packaging assembly App 20030044130 - Crane, Stanford W. JR. ; et al.	2003-03-06
Semiconductor die package having mesh power and ground planes App 20020117751 - Crane, Jr., Stanford W. ; et al.	2002-08-29
Adaptable high integrated electric interconnecting system Grant 6,270,366 - Jeon , et al. August 7, 2	2001-08-07

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