Jeon; Jong-Keun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jeon; Jong-Keun.The latest application filed is for "image sensor module and method of manufacturing the same, and imaging device including the image sensor and method of manufacturing the imaging device".

Company Profile

2.11.12

Jeon; Jong-Keun - Cheonan-si KR
- Cheonan-si KR
Jeon; Jong-Keun - Chungcheongnam-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of manufacturing an image sensor module Grant 9,554,024 - Yi , et al. January 24, 2	2017-01-24
Image Sensor Module And Method Of Manufacturing The Same, And Imaging Device Including The Image Sensor And Method Of Manufacturing The Imaging Device App 20140083600 - YI; Dong-Hun ; et al.	2014-03-27
Image sensor module having a wafer level chip size package and method of manufacting the same and imaging device including the image sensor module and method of manufacturing the image device Grant 08619185 -	2013-12-31
Image sensor module having a wafer level chip size package and method of manufacting the same and imaging device including the image sensor module and method of manufacturing the image device Grant 8,619,185 - Yi , et al. December 31, 2	2013-12-31
Semiconductor package and method of manufacturing the semiconductor package Grant 8,115,323 - Sin , et al. February 14, 2	2012-02-14
Tape structures, and methods and apparatuses for separating a wafer using the same Grant 7,939,917 - Lee , et al. May 10, 2	2011-05-10
Image Sensor Module And Imaging Device Including The Image Sensor Module App 20110080516 - Yi; Dong-Hun ; et al.	2011-04-07
Tape structures, and methods and apparatuses for separating a wafer using the same App 20090068819 - Lee; Chang-Hoon ; et al.	2009-03-12
Method of processing a semiconductor wafer for manufacture of semiconductor device Grant 7,452,753 - Chun , et al. November 18, 2	2008-11-18
Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20080265431 - Sin; Wha-Su ; et al.	2008-10-30
Molding apparatus, molded semiconductor package using multi-layered film, fabricating and molding method for fabricating the same App 20080251949 - Sin; Wha-Su ; et al.	2008-10-16
Method of forming solder ball, and fabricating method and structure of semiconductor package using the same Grant 7,427,558 - Kim , et al. September 23, 2	2008-09-23
Package stack and manufacturing method thereof Grant 7,420,814 - Kim , et al. September 2, 2	2008-09-02
POGO pin and test socket including the same Grant 7,245,138 - Jeong , et al. July 17, 2	2007-07-17
Semiconductor package with improved chip attachment and manufacturing method thereof Grant 7,235,887 - Lee , et al. June 26, 2	2007-06-26
Insert block with pusher to push semiconductor device under test Grant 7,151,368 - Joung , et al. December 19, 2	2006-12-19
POGO pin and test socket including the same App 20060145719 - Jeong; Hyeck-Jin ; et al.	2006-07-06
Package stack and manufacturing method thereof App 20060076665 - Kim; Jae-Hong ; et al.	2006-04-13
Insert block for testing semiconductor device App 20060071656 - Joung; Hyeck-Jin ; et al.	2006-04-06
Method of forming solder ball, and fabricating method and structure of semiconductor package using the same App 20060057833 - Kim; Jae-Hong ; et al.	2006-03-16
Method of processing a semiconductor wafer for manufacture of semiconductor device App 20060008948 - Chun; Dae-Sang ; et al.	2006-01-12
Apparatus for ejecting relatively thin IC chip from semiconductor wafer App 20060003491 - Kim; Goon-Woo ; et al.	2006-01-05
Semiconductor package with improved chip attachment and manufacturing method thereof App 20050040514 - Lee, Jong-Ung ; et al.	2005-02-24

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