JEON; Jae Hyun

Patent Applications and Registrations

Patent applications and USPTO patent grants for JEON; Jae Hyun.The latest application filed is for "flexible electrode substrate including porous electrode, and method for manufacturing same".

Company Profile

0.10.12

JEON; Jae Hyun - Daegu KR
Jeon; Jae Hyun - Seoul KR
Jeon; Jae Hyun - Kimcheon-Si KR
Jeon; Jae Hyun - Gyeonsangbuk-Do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Flexible Electrode Substrate Including Porous Electrode, And Method For Manufacturing Same App 20220302458 - YOON; Ha Na ; et al.	2022-09-22
Method for voltage dip compensation of inverter Grant 9,525,363 - Jeon December 20, 2	2016-12-20
Method For Voltage Dip Compensation Of Inverter App 20150357936 - JEON; Jae Hyun	2015-12-10
Apparatus and method for controlling medium voltage inverter Grant 9,093,892 - Jeon July 28, 2	2015-07-28
Method for compensating instantaneous power failure in medium voltage inverter and medium voltage inverter system by using the same Grant 8,970,159 - Choi , et al. March 3, 2	2015-03-03
Method For Compensating Instantaneous Power Failure In Medium Voltage Inverter And Medium Voltage Inverter System By Using The Same App 20130076285 - CHOI; JUNG MUK ; et al.	2013-03-28
Polishing slurry, method of producing same, and method of polishing substrate Grant 8,361,177 - Kim , et al. January 29, 2	2013-01-29
Apparatus And Method For Controlling Medium Voltage Inverter App 20130020976 - JEON; Jae Hyun	2013-01-24
Device and method for controlling high voltage inverter by using neutral point Grant 8,345,455 - Jeon January 1, 2	2013-01-01
Control Device And Control Method Of High Voltage Inverter App 20110050199 - JEON; Jae Hyun	2011-03-03
Polishing Slurry, Method Of Producing Same, And Method Of Polishing Substrate App 20090133336 - Kim; Dae Hyeong ; et al.	2009-05-28
Polishing Slurry, Method Of Producing Same, And Method Of Polishing Substrate App 20090100765 - Kim; Dae Hyeong ; et al.	2009-04-23
Polishing slurry, method of producing same, and method of polishing substrate Grant 7,470,295 - Kim , et al. December 30, 2	2008-12-30
Slurry for CMP and method of polishing substrate using same Grant 7,364,600 - Kim , et al. April 29, 2	2008-04-29
Polishing slurry, method of producing same, and method of polishing substrate App 20060032149 - Kim; Dae Hyeong ; et al.	2006-02-16
Slurry for CMP and method of polishing substrate using same App 20050252092 - Kim, Dae Hyeong ; et al.	2005-11-17
Polishing slurry, method of producing same, and method of polishing substrate App 20050198912 - Kim, Dae Hyung ; et al.	2005-09-15

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