Jeon; Hyung Jun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jeon; Hyung Jun.The latest application filed is for "wafer bonding apparatuses".

Company Profile

2.25.23

Jeon; Hyung Jun - Suwon-si KR
Jeon; Hyung-Jun - Seoul KR
Jeon; Hyung-Jun - Yongsan-gu KR
Jeon; Hyung Jun - Hwaseong N/A KR
Jeon; Hyung jun - Hwaseong-si KR
Jeon; Hyung Jun - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer Bonding Apparatuses App 20200373186 - Kim; Hoe Chul ; et al.	2020-11-26
Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devices Grant 10,580,726 - Chun , et al.	2020-03-03
Semiconductor Devices And Semiconductor Packages Including The Same, And Methods Of Manufacturing The Semiconductor Devices App 20190131228 - CHUN; Jin-Ho ; et al.	2019-05-02
Fan out wafer level package type semiconductor package and package on package type semiconductor package including the same Grant 10,153,219 - Jeon , et al. Dec	2018-12-11
Fan Out Wafer Level Package Type Semiconductor Package And Package On Package Type Semiconductor Package Including The Same App 20180076103 - JEON; Hyung-jun ; et al.	2018-03-15
Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devices Grant 9,691,685 - Lee , et al. June 27, 2	2017-06-27
Semiconductor Devices And Methods Of Manufacturing The Same, And Semiconductor Packages Including The Semiconductor Devices App 20170033032 - Lee; Kyu-Ha ; et al.	2017-02-02
Apparatus and method for connecting access point in portable terminal Grant 9,107,143 - Kim , et al. August 11, 2	2015-08-11
Gate system Grant 8,742,930 - Hong , et al. June 3, 2	2014-06-03
Semiconductor Device And Method For Fabricating The Same App 20140145327 - JEON; Hyung-Jun ; et al.	2014-05-29
Integrated circuit package system and method of manufacture thereof Grant 8,633,056 - Jeon , et al. January 21, 2	2014-01-21
Vector modulator Grant 8,588,337 - Choi , et al. November 19, 2	2013-11-19
Method and apparatus for detecting offset signal of transmission leakage signal in RF transceiver Grant 8,537,881 - Choi , et al. September 17, 2	2013-09-17
Reader based on RFID Grant 8,451,125 - Hong , et al. May 28, 2	2013-05-28
Vector modulator using time delay and phase shifter Grant 8,400,229 - Choi , et al. March 19, 2	2013-03-19
Shielded stacked integrated circuit packaging system and method of manufacture thereof Grant 8,368,200 - Jang , et al. February 5, 2	2013-02-05
Rfid Antenna System And Method For Controlling The Same App 20130009755 - HONG; Jin Kuk ; et al.	2013-01-10
Vector Modulator App 20120294388 - Choi; Heon soo ; et al.	2012-11-22
Vector Modulator Using Time Delay And Phase Shifter App 20120229227 - Choi; Heon Soo ; et al.	2012-09-13
Apparatus And Method For Connecting Access Point In Portable Terminal App 20120127925 - Kim; Jong-Seok ; et al.	2012-05-24
Apparatus And Method For Updating Data In Portable Terminal App 20120077529 - Kim; Jong-Seok ; et al.	2012-03-29
Semiconductor wafer scale package system Grant 8,114,771 - Jeon , et al. February 14, 2	2012-02-14
Shielded Stacked Integrated Circuit Packaging System And Method Of Manufacture Thereof App 20110298107 - Jang; Ki Youn ; et al.	2011-12-08
Gate System App 20110227701 - HONG; Jin Kuk ; et al.	2011-09-22
Shielded stacked integrated circuit packaging system and method of manufacture thereof Grant 8,018,040 - Jang , et al. September 13, 2	2011-09-13
Method And Apparatus For Detecting Offset Signal Of Transmission Leakage Signal In Rf Transceiver App 20110216815 - CHOI; Heon Soo ; et al.	2011-09-08
Reader Based On Rfid App 20110095892 - Hong; Jin Kuk ; et al.	2011-04-28
Integrated Circuit Package System And Method Of Manufacture Thereof App 20100171228 - Jeon; Hyung Jun ; et al.	2010-07-08
Integrated circuit underfill package system Grant 7,741,726 - Jeon , et al. June 22, 2	2010-06-22
Integrated circuit package system Grant 7,705,475 - Jeon , et al. April 27, 2	2010-04-27
Shielded Stacked Integrated Circuit Packaging System And Method Of Manufacture Thereof App 20090194853 - Jang; Ki Youn ; et al.	2009-08-06
Method of fabricating a shielded stacked integrated circuit package system Grant 7,537,962 - Jang , et al. May 26, 2	2009-05-26
Integrated Circuit Underfill Package System App 20090096112 - Jeon; Hyung Jun ; et al.	2009-04-16
Integrated circuit underfill package system Grant 7,485,502 - Jeon , et al. February 3, 2	2009-02-03
Shielded Stacked Integrated Circuit Package System App 20080150093 - Jang; Ki Youn ; et al.	2008-06-26
Integrated Circuit Package System App 20080029911 - Jeon; Hyung Jun ; et al.	2008-02-07
Integrated Circuit Underfill Package System App 20070176285 - Jeon; Hyung Jun ; et al.	2007-08-02
Semiconductor Wafer Scale Package System App 20070164422 - Jeon; Hyung Jun ; et al.	2007-07-19
Bump For Overhang Device App 20070001296 - Lee; Hun Teak ; et al.	2007-01-04

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