Jeon; Hae-Sang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jeon; Hae-Sang.The latest application filed is for "adhesive tape for manufacturing electronic components".
- Jeon; Hae-Sang - Seoul N/A KR
| Patent | Date |
|---|---|
| Adhesive tape for manufacturing electronic components Grant 9,090,800 - Choi , et al. July 28, 2 | 2015-07-28 |
| Adhesive Tape for Manufacturing Electronic Components App 20110318580 - Choi; Sung-Hwan ; et al. | 2011-12-29 |
| Resin Composition For No-flow Underfill, No-flow Underfill Flim Using The Same And Manufacturing Method Thereof App 20110166258 - Hong; Seung Woo ; et al. | 2011-07-07 |
| Lamination Method Of Adhesive Tape And Lead Frame App 20110056623 - IM; Min-Ho ; et al. | 2011-03-10 |
| Method For Treating High Hydrophobic Surface Of Substrate App 20100330278 - Choi; Sung-Hwan ; et al. | 2010-12-30 |
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