Jeon; Dong Ki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jeon; Dong Ki.The latest application filed is for "semiconductor device fabricating method".

Company Profile

0.5.12

Jeon; Dong Ki - Icheon-si KR
Jeon; Dong Ki - Gangneung-si KR
Jeon; Dong-Ki - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method for manufacturing the same Grant 7,851,341 - Jeon December 14, 2	2010-12-14
Semiconductor device fabricating method Grant 7,709,381 - Han , et al. May 4, 2	2010-05-04
Method for fabricating semiconductor device Grant 7,666,762 - Jeon , et al. February 23, 2	2010-02-23
Semiconductor device and method for fabricating the same Grant 7,601,633 - Jeon October 13, 2	2009-10-13
Semiconductor device fabricating method App 20080160757 - Han; Jaewon ; et al.	2008-07-03
Method for Fabricating Semiconductor Device App 20080145988 - JEON; DONG KI ; et al.	2008-06-19
Fabricating Method of Semiconductor Device App 20080124923 - JEON; DONG KI	2008-05-29
Semiconductor Device and Method for Fabricating the Same App 20080111240 - JEON; DONG Ki	2008-05-15
Semiconductor Device And Method Of Fabricating The Same App 20080073788 - Jeon; Dong-Ki	2008-03-27
Semiconductor device and method for manufacturing the same App 20080054492 - Jeon; Dong Ki	2008-03-06
Gate Electrode Of Semiconductor Device And Method Of Forming Same App 20080054381 - Jeon; Dong-Ki	2008-03-06
Method for manufacturing semiconductor device App 20080057699 - Jeon; Dong Ki	2008-03-06
Semiconductor Device and Method for Manufacturing the Same App 20080048276 - JEON; DONG KI	2008-02-28
Tisin Layer On Semiconductor Device App 20080029912 - Jeon; Dong-Ki	2008-02-07
Method for forming a metal contact in a semiconductor device having a barrier metal layer formed by homogeneous deposition App 20060134930 - Jeon; Dong-Ki	2006-06-22
Methods of forming metal wiring of semiconductor devices including sintering the wiring layers and forming a via hole with a barrier metal Grant 7,060,603 - Han , et al. June 13, 2	2006-06-13
Methods of forming metal wiring of semiconductor devices App 20040132283 - Han, Jae-Won ; et al.	2004-07-08

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