Jeon; Dong Ju

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jeon; Dong Ju.The latest application filed is for "metal precursor, manufacturing method therefor, and method for forming thin film by using same".

Company Profile

2.19.21

Jeon; Dong Ju - Daejeon KR
Jeon; Dong Ju - Seoul KR
Jeon; Dong Ju - Yusung-ku KR
Jeon; Dong-Ju - Taejeon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal precursor for making metal oxide Grant 10,858,379 - Park , et al. December 8, 2	2020-12-08
Metal Precursor, Manufacturing Method Therefor, And Method For Forming Thin Film By Using Same App 20180334471 - PARK; Bo Keun ; et al.	2018-11-22
Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof Grant 10,134,664 - Kang , et al. November 20, 2	2018-11-20
Ruthenium Precursor, Preparation Method Therefor And Method For Forming Thin Film Using Same App 20180282866 - PARK; Bo-Keun ; et al.	2018-10-04
Strontium precursor, method for preparing same, and method for forming thin film by using same Grant 9,790,238 - Park , et al. October 17, 2	2017-10-17
Integrated circuit packaging system with support structure and method of manufacture thereof Grant 9,768,102 - Jeon , et al. September 19, 2	2017-09-19
Electroless surface treatment plated layers of printed circuit board and method for preparing the same Grant 9,743,508 - Lee , et al. August 22, 2	2017-08-22
Integrated Circuit Packaging System With Embedded Pad On Layered Substrate And Method Of Manufacture Thereof App 20170162495 - Kang; MinKyung ; et al.	2017-06-08
Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof Grant 9,607,938 - Kang , et al. March 28, 2	2017-03-28
2, 4-pyrimidine derivatives and use thereof Grant 9,573,907 - Kim , et al. February 21, 2	2017-02-21
Electroless Surface Treatment Plated Layers Of Printed Circuit Board And Method For Preparing The Same App 20150382452 - LEE; Dong Jun ; et al.	2015-12-31
Method of manufacture of support system with fine pitch Grant 9,210,816 - Roh , et al. December 8, 2	2015-12-08
Integrated circuit packaging system with embedded component and method of manufacture thereof Grant 9,171,795 - Jeon , et al. October 27, 2	2015-10-27
Electroless surface treatment plated layers of printed circuit board and method for preparing the same Grant 9,150,002 - Lee , et al. October 6, 2	2015-10-06
Strontium Precursor, Method For Preparing Same, And Method For Forming Thin Film By Using Same App 20150175629 - Park; Bo-Keun ; et al.	2015-06-25
Integrated Circuit Packaging System With Embedded Component And Method Of Manufacture Thereof App 20150171002 - Jeon; Dong Ju ; et al.	2015-06-18
Integrated Circuit Packaging System With Embedded Pad On Layered Substrate And Method Of Manufacture Thereof App 20150001705 - Kang; MinKyung ; et al.	2015-01-01
Integrated Circuit Packaging System With Support Structure And Method Of Manufacture Thereof App 20130249078 - Jeon; Dong Ju ; et al.	2013-09-26
Electroless Surface Treatment Plated Layers Of Printed Circuit Board And Method For Preparing The Same App 20130003332 - Lee; Dong Jun ; et al.	2013-01-03
Printed Circuit Board And Method For Manufacturing The Same App 20130000960 - LEE; Dong Jun ; et al.	2013-01-03
Novel 2, 4-pyrimidine Derivatives And Use Thereof App 20120322802 - Kim; Sunghoon ; et al.	2012-12-20
7-(3',4'-Dialkoxyphenyl)[1,2,4]-triazolo[1,5-A]pyrimidine compounds, process for preparing thereof, and pharmaceutical composition for treating or preventing asthma, chronic obstructive pulmonary disease, arthritis, atopic dermatitis, tumor and degenerative brain diseases comprising the same Grant 8,143,262 - Jeon , et al. March 27, 2	2012-03-27
Method of manufacturing printed circuit board App 20110079349 - Cho; Suk Hyeon ; et al.	2011-04-07
Package Substrate And Method Of Fabricating The Same App 20110061922 - LEE; Jae Joon ; et al.	2011-03-17
Manufacturing Method Of Circuit Board App 20110056614 - AN; Jin-Yong ; et al.	2011-03-10
Printed Circuit Board Having A Bump And A Method Of Manufacturing The Same App 20110048786 - Cho; Suk Hyeon ; et al.	2011-03-03
7-(3',4'-Dialkoxyphenyl)-[1,2,4]-Triazolo[1,5-A]Pyrimidine Compounds, Process for Preparing Thereof, and Pharmaceutical Composition for Treating or Preventing Asthma, Chronic Obstructive Pulmonary Disease, Arthritis, Atopic Dermatitis, Tumor and Degenerative Brain Diseases Comprising the Same App 20100105704 - Jeon; Dong Ju ; et al.	2010-04-29
Printed circuit board and manufacturing method thereof App 20090027864 - Cho; Chung-Woo ; et al.	2009-01-29
Photochromic diarylethene substituted with isoxazole group Grant 6,846,934 - Kim , et al. January 25, 2	2005-01-25
Herbicidal 5-benzyloxymethyl-1,2-isoxazoline derivatives Grant 6,838,416 - Ryu , et al. January 4, 2	2005-01-04
Herbicidal 5-benzyloxymethyl-1,2-isoxazoline derivatives App 20040023808 - Ryu, Eung-Kul ; et al.	2004-02-05

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